China Solder Paste

China Solder Paste

China Solder Paste JZ505 is a lead-free, no clear solder paste designed for a broad range of application. JZ-505’S broad processing window is designed to minimize transition concerns from tin/lead to lead free solder process. It can yield brick -like prints.

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Product Description

INTRODUCTION     

China Solder Paste JZ505 is a lead-free, no clear solder paste designed for a broad range of application. JZ-505’S broad processing window is designed to minimize transition concerns from tin/lead to lead free solder process.  It can yield brick -like prints.

PRODUCT FEATURES

l   Good printing rolling and tin falling, even on 0.3mm pitch pad

l   Long operation time, won’t curing even after 8H

l   Good welding property

l   Good ICT test performance

l   Can be used for paste-in-hole craft 

TECHNICAL FEATURES

1. Standards: ANSI/J-STD-004/005/006;JIS Z 3197-86;JIS Z 3283-86;IPC-TM-650;

2. Tin powder features

(1). Alloying Constituent

No.

Ingredients

ContentWt%

 

 

 

1

Tin(Sn)%

99.0+0.5/99.5+0.5

 

 

 

2

Sliver(Ag)%

0.3+0.5

 

 

 

3

Copper(Cu)%

0.7+0.2

 

 

 

4

Antimony(Sb)%

≤0.02

 

 

 

5

Bismuth (Bi)%

≤0.10

 

 

 

6

Fe(Fe)%

≤0.02

 

 

 

7

Arsenic(As)%

≤0.03

 

 

 

8

Zinc (Zn)%

≤0.002

 

 

 

9

Aluminum(Al)%

≤0.002

 

 

 

10

Lead(Pb)%

≤0.10

 

 

 

11

Cadmium(Cd)%

≤0.002

 

 

 

Note: All ingredients meet the J-STD-006 standard

 

 

 

(2)  . Tin Powder Particle Distribution

Item

Mesh Code

Diameter

Applicable pitch

T2

-200/+325

45~75

≤0.65mm(25mil)

T2.5

-230/+500

25~63

≤0.65mm(25mil)

T3

-325/+500

25~45

≤0.5mm(20mil)

T4

-400/+500

25~38

≤0.4mm(16mil)

T5

-400/+635

20~38

≤0.4mm(16mil)

T6

N.A.

10~30

Micro BGA

(3)  . Alloy physical properties

Melting Point

217~218℃

Alloy Density

7.4g/cm3

Hardness

15HB

Thermal Conductivity

64 J/M.S.K

Tensile Strength

52Mpa


Elongation

27%

electrical conductivity

14%ofIACS

 

3. Flux Characteristic

LEVEL

ROLO

J-STD-004

 chlorine content

<0.2wt%

potentiometric titration

 

Before warming up

>1×1013Ω

25mil combplate

After warming up

>1×1012Ω

40℃ 90%RH 96Hrs

Liquor Resistance

>1×105Ω

Condivity Tester

 Copper Mirror corossion  Test

Pass (No evidence of  Corossion)

IPC-TM-650

 

 

silver Chromate test paper

Pass (No discoloration)

IPC-TM-650

Residue Aridity

Pass

In house

pH

5.0+0.5

In house

(4)  . Tin Characteristic

Metal Content

85~91wt%(+0.5)

Gravimetric Method

Flux Content

9~15wt%(+0.5)

Gravimetric Method

Viscosity

900Kcps+10%Brookfield(5rpm)

T3,90%metal for printing

2000Poise+10%Malcolm(10rpm)

Trixtropy Index

0.60+0.05

In house

Spray Factor

>83%

Copper plate(90%metal)

Slump Consistency Test

Pass

J-STD-005

Tin Sweat

Pass

In house

Adhesion (Vs Exposure Time

46gF(0 H)

IPC-TM-650

+5%

54gF(2 H)

66gF(4 H)

44gF(8 H)

Stencil Life

>8 hours

In house

 

STORAGE

l   Sealed storage at 5~10℃(high temperature will shorten its life time, temperature <0℃ will cause  crystallization, which will effect product’s characteristic.

l   Shelf life: 3 months

l   This product need to be put at room temperature for >4h to wait the temperature rise up again after been taking out from the freezer.

REFERENCE REFLOW PROFILE

PACKING

500G/unit

Other Information

The above information are correct, but does not contain all of the information and can only be used as a guide.

This product is ROHS, REACH compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.

 

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