China Solder Paste JZ505 is a lead-free, no clear solder paste designed for a broad range of application. JZ-505’S broad processing window is designed to minimize transition concerns from tin/lead to lead free solder process. It can yield brick -like prints.
INTRODUCTION
China Solder Paste JZ505 is a lead-free, no clear solder paste designed for a broad range of application. JZ-505’S broad processing window is designed to minimize transition concerns from tin/lead to lead free solder process. It can yield brick -like prints.
PRODUCT FEATURES
l Good printing rolling and tin falling, even on 0.3mm pitch pad
l Long operation time, won’t curing even after 8H
l Good welding property
l Good ICT test performance
l Can be used for paste-in-hole craft
TECHNICAL FEATURES
1. Standards: ANSI/J-STD-004/005/006；JIS Z 3197-86；JIS Z 3283-86；IPC-TM-650；
2. Tin powder features
(1). Alloying Constituent
|
No. |
Ingredients |
ContentWt% |
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1 |
Tin(Sn)% |
99.0+0.5/99.5+0.5 |
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2 |
Sliver(Ag)% |
0.3+0.5 |
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3 |
Copper(Cu)% |
0.7+0.2 |
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4 |
Antimony(Sb)% |
≤0.02 |
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5 |
Bismuth (Bi)% |
≤0.10 |
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6 |
Fe(Fe)% |
≤0.02 |
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7 |
Arsenic(As)% |
≤0.03 |
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8 |
Zinc (Zn)% |
≤0.002 |
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9 |
Aluminum(Al)% |
≤0.002 |
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10 |
Lead(Pb)% |
≤0.10 |
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11 |
Cadmium(Cd)% |
≤0.002 |
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Note: All ingredients meet the J-STD-006 standard |
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(2) . Tin Powder Particle Distribution
|
Item |
Mesh Code |
Diameter |
Applicable pitch |
|
T2 |
-200/+325 |
45~75 |
≤0.65mm(25mil) |
|
T2.5 |
-230/+500 |
25~63 |
≤0.65mm(25mil) |
|
T3 |
-325/+500 |
25~45 |
≤0.5mm(20mil) |
|
T4 |
-400/+500 |
25~38 |
≤0.4mm(16mil) |
|
T5 |
-400/+635 |
20~38 |
≤0.4mm(16mil) |
|
T6 |
N.A. |
10~30 |
Micro BGA |
(3) . Alloy physical properties
|
Melting Point |
217~218℃ |
|
Alloy Density |
7.4g/cm3 |
|
Hardness |
15HB |
|
Thermal Conductivity |
64 J/M.S.K |
|
Tensile Strength |
52Mpa |
|
|
27% |
|
electrical conductivity |
14%ofIACS |
3. Flux Characteristic
|
LEVEL |
ROLO |
J-STD-004 |
|
|
chlorine content |
<0.2wt% |
potentiometric titration |
|
|
|
Before warming up |
>1×1013Ω |
25mil combplate |
|
After warming up |
>1×1012Ω |
40℃ 90%RH 96Hrs |
|
|
Liquor Resistance |
>1×105Ω |
Condivity Tester |
|
|
Copper Mirror corossion Test |
Pass (No evidence of Corossion) |
IPC-TM-650 |
|
|
silver Chromate test paper |
Pass (No discoloration) |
IPC-TM-650 |
|
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Residue Aridity |
Pass |
In house |
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pH |
5.0+0.5 |
In house |
|
(4) . Tin Characteristic
|
Metal Content |
85~91wt%(+0.5) |
Gravimetric Method |
|
Flux Content |
9~15wt%(+0.5) |
Gravimetric Method |
|
Viscosity |
900Kcps+10%Brookfield(5rpm) |
T3,90%metal for printing |
|
2000Poise+10%Malcolm(10rpm) |
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|
Trixtropy Index |
0.60+0.05 |
In house |
|
Spray Factor |
>83% |
Copper plate(90%metal) |
|
Slump Consistency Test |
Pass |
J-STD-005 |
|
Tin Sweat |
Pass |
In house |
|
Adhesion (Vs Exposure Time |
46gF(0 H) |
IPC-TM-650 +5% |
|
54gF(2 H) |
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|
66gF(4 H) |
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|
44gF(8 H) |
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|
Stencil Life |
>8 hours |
In house |
STORAGE
l Sealed storage at 5~10℃(high temperature will shorten its life time, temperature <0℃ will cause crystallization, which will effect product’s characteristic.
l Shelf life: 3 months
l This product need to be put at room temperature for >4h to wait the temperature rise up again after been taking out from the freezer.
REFERENCE REFLOW PROFILE
PACKING
500G/unit
Other Information
This product is ROHS, REACH compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.
