TS4108A makes SMD bonding simpler. This one‑part epoxy formulation cures at high temperature and requires no manual mixing – just open and load onto the machine. Its excellent thixotropy ensures stable performance in high‑speed dispensing and printing, with no stringing or slumping. After curing, it delivers high adhesive strength to firmly hold components. It also meets REACH and RoHS standards, making it an ideal choice that balances performance and ease of use.
Features & Benefits of Heat-curing Red Glue TS4108A
Tensan SMD red glue 4108A is a one-component epoxy adhesive, curing at high temperature.
It is designed for SMD components on printed circuit board bonding. 4108A has suitable for high-speed SMT placement machine Dispensing and stencil printing.
It is of high adhesive strength after curing .
◆ REACH, ROHS, certified
◆ Excellent thixotropy
◆ Good adhesive strength after curing
◆ Easy to mix and use
Instructions and Precautions of Heat-curing Red Glue TS4108A
Cold storage 4108A to be rewarmed before use, 30ml syringe to be 1 hour, 300ml 24 hours. Storage tank or dispensing mouth temperature at 25℃-30℃ can
help improve the high-speed dispensing effect.
Precautions of Heat-curing Red Glue TS4108A:
1.In order to avoid contaminating unused glue, any glue can not be back into the original packaging.
2.Glue placing in the air will absorb trace moisture performance, which will influence the properties of glue, so it should be avoided. In the stencil printing,
do not put SMT printed circuit board in the air for too long,
patch curing as soon as possible, if possible, air humidity should be controlled.
Packing Information
30ml/syringe
200g/syringe
Storage andValidity
2-8℃, cool and dry place, it can be stored for 6 months; room temperature (25℃), it can be stored for 1 month.
Typical Properties of Heat-curing Red Glue TS4108A
|
Item |
Index |
|
Specific Gravity (g/cm3) |
1.28 |
|
Viscosity at 5rpm 25℃ |
300.000cps |
|
Adhesive Strength ( 2125c) |
44N(4.5kgf) |
|
Adhesive Strength (Mini-mold tr) |
45N(4.6kgf) |
|
Adhesive Strength (SOP-IC 16P) |
92N(9.4kgf) |
|
Thixotropy Index |
6.3 |
|
Electric Property (Ω.cm) |
2.6*10^16 |
|
Resistance Insulation (Ω.cm) |
1.0*10^14 |
|
Resistance Initial Value (Ω.cm) |
1.2*10^12 |
|
Curing Condition |
150℃/60sec 130℃/90sec
|
|
Applying Method |
High -speed dispenser |
|
Dielectric Constant |
3.62/MHz |
|
Dielectric Loss Tangent |
0.013/1MHz |
|
Preservation Condition |
Refrigerated storage at 2-8℃ |
|
Package Style |
30ml/syringe 200g/syringe |
Other Information
The above information are correct, but does not contain all of the information and can only be used as a guide.
This product is ROHS, REACH, compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.
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