High-Thixotropy Red SMD Adhesive

The TS4109B, manufactured by Tianshan, is a one‑part, low‑temperature, rapid‑cure epoxy adhesive formulated for the reliable attachment of SMD components onto printed circuit boards. It exhibits outstanding thixotropic behaviour, which makes it ideally suited for stencil printing and thick‑board applications.

Key Features & Benefits

• Low‑temperature curing: Hardens quickly at 120 °C within 90 to 120 seconds, safeguarding thermally sensitive parts.
• Superb thixotropy: Delivers excellent print definition and reduces the risk of paste slumping, especially for fine‑pitch stencils.
• Dependable performance: Offers strong adhesion, proven resistance to soldering heat (up to 260 °C), and sustained durability under demanding environmental conditions.
• Extended pot life: Remains workable for up to 48 hours at room temperature (25 °C, 50±10% RH) without significant viscosity change.
• Non‑corrosive: Does not attack copper mirrors, ensuring long‑term circuit integrity.

Curing Conditions

The recommended curing profile is 120°C for 90 to 120 seconds. For optimal performance, the adhesive can also achieve cure at lower temperatures with extended time:

• 105°C: 10 minutes (achieves ~97.6% curing strength).
• 120°C: 2 minutes (achieves ~68% strength) / 4 minutes (achieves ~92.5% strength).

Note: Actual heating time in production may be longer due to the pre-heating phase.

Material Properties (Before Curing)

Material Properties (After Curing)

Thermal & Aging Performance

• Heat resistance: The cured adhesive retains a high proportion of its initial bonding force even after prolonged high‑temperature exposure.
• Aging test results (adhesion retention rate):

Packaging

Standard packaging options: 30 ml syringe, 200 g cartridge, 360 g cartridge, or customised sizes upon request.

Storage & Handling

• Storage: Keep refrigerated at 2 °C to 8 °C; shelf life is 6 months under these conditions.

• Thawing (return to room temperature):

1. For 30 ml syringes: allow 2–4 hours at 25±3 °C.
2. For 200 g/360 g cartridges: allow 4–6 hours at 25±3 °C.
3. Important: Never use external heat sources to accelerate thawing.

• Working environment: Ideally maintained at 25±3 °C and 50–70% RH.

• Good practice: Do not pour unused adhesive back into the original container to avoid contamination. Once dispensed, apply the adhesive and mount components as soon as possible, as prolonged exposure to air can absorb moisture and impair performance.