Low-Temp Curing Red Glue

TS4109B is a one-part, heat-activated epoxy adhesive engineered to provide structural bonding for surface-mounted devices. The TS4109B leverages advanced epoxy resin chemistry to deliver a high glass transition temperature coupled with low coefficient of thermal expansion, ensuring mechanical alignment stability across temperature cycles.

Key Features & Benefits

• Chemically Stable: The single-component design eliminates mixing errors and entrapped air bubbles common in two-part systems.
• Thermally Conductive Insulator: Acts as an electrical barrier while efficiently transferring thermal stress away from the joint.
• Thixotropic Index: Formulated with a precise filler package to deliver a controlled particle size distribution (10-15μm) for clog-free printing.
• DSC Verified Cure: The curing kinetics have been fully characterized using Differential Scanning Calorimetry to ensure batch-to-batch consistency.
• Corrosion Resistance: Inert to copper and common PCB finishes, preventing electrochemical migration.

Material Properties (Before Curing)

Curing Conditions

The recommended curing profile is 120°C for 90 to 120 seconds. For optimal performance, the adhesive can also achieve cure at lower temperatures with extended time:

• 105°C: 10 minutes (achieves ~97.6% curing strength).
• 120°C: 2 minutes (achieves ~68% strength) / 4 minutes (achieves ~92.5% strength)

Note: Actual heating time in production may be longer due to the pre-heating phase.

Material Properties (After Curing)

Thermal & Aging Performance

Thermo-Mechanical Integrity: The cured material exhibits a distinct transition phase around 110°C, defining its upper operational limit for structural rigidity.

Aging Test Results (Adhesion Retention Rate):

Packaging

Standard Packaging: 30ml per syringe, 200g per cartridge, 360g per cartridge, or customized to meet specific production line needs.

Storage & Handling

• Preservation: The reactive nature of the adhesive requires continuous refrigeration at 2-8°C for a 6-month storage life.
• Ambient Conditioning: It is essential to allow the product to reach 25±3°C before use. Thaw times range from 2-4 hours for 20-30ml packs to 4-6 hours for 200-360g packs. Do not attempt to accelerate this process with external heat.
• Operational Protocols: Apply under recommended climate conditions of 25±3°C and 50-70% RH. Seal the container immediately after dispensing to limit moisture absorption. Never reintroduce scrap material into the main supply to maintain the purity of the remaining batch.