Low-Temperature Red SMD Adhesive

Key Features & Benefits

• Low-Temperature Curing: Cures rapidly at 120°C within 90–120 seconds, protecting heat-sensitive components.
• High Thixotropy: Provides excellent printability and prevents solder paste bleeding, ideal for fine-pitch stencil printing.
• High Reliability: Offers strong adhesion, excellent resistance to soldering heat (260°C), and long-term durability under harsh conditions.
• Long Working Time: Maintains printability for up to 48 hours at room temperature (25°C, 50±10% RH).
• Corrosion-Free: Non-corrosive to copper mirrors, ensuring the integrity of PCB circuitry.

Material Properties (Before Curing)

Curing Conditions

The recommended curing profile is 120°C for 90 to 120 seconds. For optimal performance, the adhesive can also achieve cure at lower temperatures with extended time:

• 105°C: 10 minutes (achieves ~97.6% curing strength).
• 120°C: 2 minutes (achieves ~68% strength) / 4 minutes (achieves ~92.5% strength).

Note: Actual heating time in production may be longer due to the pre-heating phase.

Material Properties (After Curing)

Thermal & Aging Performance

• Heat Resistance: The adhesive maintains strong adhesion even after exposure to high temperatures.
• Aging Test Results (Adhesion Retention Rate):

PackagingStandard Packaging: 

30ml syringe, 200g cartridge, 360g cartridge, or custom packaging as per customer request.

Storage & HandlingStorage:

 Must be stored in a refrigerator at 2°C to 8°C. Shelf life is 6 months under these conditions.Thawing (Return to Room Temp):30ml syringes: 2 – 4 hours at 25±3°C.200g/360g cartridges: 4 – 6 hours at 25±3°C.Do not use artificial heating to speed up the thawing process.Application Environment: Recommended at 25±3°C and 50–70% RH.Important: Do not return unused adhesive to the original container to avoid contamination. Ensure the product is used promptly after dispensing to prevent moisture absorption.