Multi-use SMD Red Glue

Multi-use SMD Red Glue

Features & Benefits Tensan Multi-use SMD Red Glue 4108A is a one-component epoxy adhesive, curing at high temperature. It is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use

Model:TS4108A

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Product Description

Features & Benefits of  Multi-use SMD Red Glue   TS4108A     

Tensan SMD red glue 4108A is a one-component epoxy adhesive, curing at high temperature.

It is designed for SMD components on printed circuit board bonding. 4108A has  suitable for high-speed SMT placement machine Dispensing and stencil printing. 

 It is of high adhesive strength after curing .

◆  REACH, ROHS, certified

◆   Excellent thixotropy

◆   Good adhesive strength after curing

◆   Easy to mix and use


Instructions and Precautions of  Multi-use SMD Red Glue   TS4108A

Cold storage 4108A to be rewarmed before use, 30ml syringe to be 1 hour, 300ml 24 hours. Storage tank or dispensing mouth temperature at 25℃-30℃ can 

help improve the high-speed dispensing effect.


Precautions of  Multi-use SMD Red Glue  TS4108A:

1.In order to avoid contaminating unused glue, any glue can not be back into the original packaging.

2.Glue placing in the air will absorb trace moisture performance, which will influence the properties of glue, so it should be avoided. In the stencil printing, 

 do not put SMT printed circuit board in the air for too long,   

patch curing as soon as possible, if possible, air humidity should be controlled.

Packing Information

30ml/syringe

200g/syringe

Storage andValidity

2-8℃, cool and dry place, it can be stored for 6 months; room temperature (25℃), it can be stored for 1 month.


Typical Properties of  Multi-use SMD Red Glue   TS4108A

Item

Index

Specific Gravity

(g/cm3)

1.28

Viscosity at 5rpm 25℃

300.000cps

Adhesive Strength

( 2125c)

44N(4.5kgf)

Adhesive Strength

(Mini-mold tr)

45N(4.6kgf)

Adhesive Strength

(SOP-IC 16P)

92N(9.4kgf)

Thixotropy Index

6.3

Electric Property

(Ω.cm)

2.6*10^16

Resistance Insulation

(Ω.cm)

1.0*10^14

Resistance Initial Value

(Ω.cm)

1.2*10^12

Curing Condition

150℃/60sec

130℃/90sec

 

Applying Method

High -speed dispenser

Dielectric Constant

3.62/MHz

Dielectric Loss Tangent

0.013/1MHz

Preservation Condition

Refrigerated storage at 2-8℃

Package Style

30ml/syringe

200g/syringe

 

Other Information

The above information are correct, but does not contain all of the information and can only be used as a guide.

This product is ROHS, REACH, compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.

 

For further info please visit our web:

 www.sztensan.com

 



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