Thermal management is a critical issue in the design of electronic systems. As the complexity of the devices continues to grow, designers and manufacturers require improved technologies to effectively remove the generated heat. While fans, heat sinks and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling. Shenzhen Tensan company thermal pads, thermal grease, thermal putty, thermal tape and graphite sheets can be used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices and the automotive industry. For more information you can visit our website: www.sztensan.com or www.chinatensan.com
What impacts may have for electronic products if using inferior potting compound ? Shenzhen Tensan company will talk about it . Using bad quality potting silicone on electronic products leads to poor electrical performance and insulation ability. Electronic components will affect each other after potting which could easily cause malfunction for electronic components . Furthermore,bad silicone potting has poor heat and cold resistance , it is difficult to bear changes between cold and heat, then the cracking cured silicone, so that rainwater penetrates into electronic components , reducing the moisture resistance of electronic products and causing electronic elements device failure. Thirdly, inferior potting compound has poor performance like poor thermal conductivity, bad high and low temperature resistance, and poor flame retardancy. It is not so effective to improve the heat transfer performance and safety factor of electronic products .
1.Thermal conductivity, the thermal conductivity [W / (m · k)] after curing reaches 0.9. 2.Adhesive strength, good adhesion to plastics. 3.Fast curing speed, easy to extrude, but not flowing, easy to operate, no glue leakage. 4.Curing resistance to cold and hot alternating performance, aging resistance and electrical insulation.
Inernational LED & OLED EXPO 2020 Exhibition date : 24th -26th June ,2020 Venue:Kintex - Korea International Exhibition Center in Goyang, Korea Organizer:EXPONU CO., LTD. Introduction The 18th Int'l LED & OLED EXP showcases product from Lights & Lighting industry. LED chips, LEDs and OLED lamps to lighting fixtures, LED display & signages are the main product range. Since 2003, Int’l LED & OLED EXPO is the largest exhibition in Korea and the world’s first B2B trade show that specializes in LED and OLED industry. Forthermore, LED EXPO provides information on LED's trends and newest technology by international LED & OLED seminar to develop the Korean LED & OLED industry.
