Features & Benefits of Thermal Potting for Power Modules TS8822 Two-component silicone potting, 1 to 1, curing at room temperature. REACH, ROHS, certified Good waterproof Good thermal conductivity Easy to mix and use
Features & Benefits of Thermal Conductive Potting TS8811 Two-component silicone potting, 1 to 1, curing at room temperature. ◆ REACH, ROHS, certified ◆ Good waterproof ◆ Good thermal conductivity ◆ Easy to mix and use
Features & Benefits of Thermally Conductive Encapsulant TS8800 Two-component silicone potting, 1 to 1, curing at room temperature. REACH, ROHS, certified Good waterproof Good thermal conductivity Easy to mix and use
Features & Benefits of Thermal Potting TS8833 Two-component silicone potting, 1 to 1, curing at room temperature. REACH, ROHS, UL VO certified Good waterproof Good thermal conductivity Easy to mix and use
TS4108A combines multiple advantages: one‑part epoxy with high‑temperature curing; excellent thixotropy for seamless use in high‑speed dispensing and stencil printing; strong adhesion after curing to keep components in place; REACH and RoHS compliant for environmental safety; and no mixing required – ready to use. In terms of process compatibility, bond strength, and ease of handling, TS4108A is a dependable partner for PCB assembly.
