Computer Thermal Pads for Sale Manufacturers

TS8866 potting compound with 1.0 W/m・K high thermal conductivity, 1:1 two-component ratio, suitable for power converters, PCB boards, and LED driver packaging. It cures quickly at room temperature, has excellent flowability, and can fully fill tiny gaps to form a seamless protective layer. After curing, it is resistant to high and low temperatures and thermal shock, with stable thermal conductivity, accelerating heat dissipation and improving equipment stability; it is also waterproof and flame retardant, ensuring safe use. Free samples are available; direct factory sales for bulk orders, with preferential pricing for large quantities.

TENSAN TS505 is formulated with these principles at its core. The solder paste with low voiding performance uses a halogen-controlled flux (L1 level, 0.085% halogens) and a carefully matched solvent system to release volatiles gradually, avoiding violent boiling that would otherwise trap gas underneath large thermal pads.

TS-350 is a lead-free, no-clean solder paste based on SAC305 alloy (Sn96.5Ag3Cu0.5), with a melting point of 221–227°C, Type 4 powder size (20–38 μm), flux content of 10.5±0.5%, viscosity of 220,000 mPa·s, and halogen content meeting L0 level. Key Advantages: Stable printing with excellent shape retention, supporting ultra-fine pitch down to 0.28mm; strong wetting performance, low voiding, minimal residue (~5%), compatible with air/nitrogen reflow; effective head-in-pillow (HiP) resistance for improved first-pass yield; fully RoHS compliant—helping you meet global environmental regulations with ease. Storage: Refrigerate at 2–10°C (do not freeze), 6-month shelf life. Allow 4+ hours of sealed warm-up before use, followed by 1–2 minutes of mixing. Applications: Consumer electronics, automotive electronics, industrial controls, telecommunications, medical devices, LED lighting.

TENSAN TS‑501 is a lead‑free, Bi‑containing alloy paste that lowers reflow temperatures while maintaining excellent printability and joint reliability. It is the ideal solder paste for automated printing environments where stability, cleanliness, and process flexibility are paramount. With Type‑4 powder, ROL1 flux, and long stencil life, this Automatic Solder Paste Printer solution ensures that every print – from the first to the thousandth – meets the highest quality standards.

TENSAN TS‑501 is a Lead-Free Solder Paste engineered to meet these demands. Formulated with a Sn‑Ag1‑Bi35 alloy, this solder paste lead free solution offers a lower melting point than conventional SAC alloys, making it ideal for assemblies with thermal‑sensitive components, flexible PCBs, and step‑soldering processes. With Type‑4 powder, ROL1 flux classification, and no‑clean residue, TS‑501 is the lead-free solder paste that combines environmental responsibility with outstanding process performance.

Thermal grease white as the heat transfer medium of electronic components and lighting assemblies, use to reduce operating temperature of the heating element. REACH, ROHS certified High thermal conductivity Good temperature resistance