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Hot Products

  • Power Supplies Thermal Paste

    Power Supplies Thermal Paste

    Features & Benefits of Power Supplies Thermal Paste Power supplies thermal paste as the heat transfer medium of electronic components and lighting assemblies, use to reduce operating temperature of the heating element. REACH, ROHS certified High thermal conductivity Good temperature resistance
  • High Performance Adhesive

    High Performance Adhesive

    TENSAN High Performance Adhesive TS6601 is semi-flow RTV silicone with good waterproof function and sealing strength. Electronic Encapsulant Adhesive can be used for bonding metal, glass, ceramics etc. material. REACH, ROHS certified MSDS for air/sea shipment Fast curing Non-corrosive to most Copper, Polycarbonate plastics material Excellent waterproof function Excellent sealing performance Good Performance for insulation
  • Easy to Handle Soft Silicone Thermal Mat Alternative of Thermal Grease

    Easy to Handle Soft Silicone Thermal Mat Alternative of Thermal Grease

    Typical applications of Thermal Pad LED lighting, lighting equipment.Household appliances, LCD monitors.Between the semiconductor and the heat sink.Communications products, smart phones, tablet PCs.Desktop computers, notebooks and other portable computers.High power Electrical appliances power supply, Top Sale Easy to Handle Soft Silicone Thermal Mat Alternative of Thermal Grease.
  • Silicone Sealant for Electronics

    Silicone Sealant for Electronics

    Silicone Sealant for Electronics is one-component silicone with bonding and sealing strength. It can be used for bonding metal, glass, ceramics etc. material. REACH, ROHS certified MSDS for air/sea shipment Non-corrosive to most metal material Good press ratio,suitable for machine dispensing Good adhesive strength Good performance in extreme condition Good flame resistance
  • Solder Paste Flux Cream

    Solder Paste Flux Cream

    TS-350 is a SAC305 (Sn96.5Ag3Cu0.5) lead-free, no-clean solder paste with a melting point of 221–227°C, Type 4 powder size (20–38 μm), flux content of 10.5±0.5%, and viscosity of 220,000 mPa·s. Key Advantages: Based on the industry-standard SAC305 alloy—offering excellent mechanical strength, thermal fatigue resistance, and reliable wetting. Stable printing, superb shape retention, low voiding, minimal residue (~5%), supports ultra-fine pitch down to 0.28mm, effective HiP resistance, and RoHS compliant.
  • SnBi Eutectic Solder Paste

    SnBi Eutectic Solder Paste

    As a fully compliant solution for environmentally conscious electronics manufacturing, SnBi Eutectic Solder Paste combines a high‑reliability flux system with fine spherical Sn42/Bi58 alloy powder. This advanced SnBi solder paste product is engineered to deliver exceptional printability, minimal residue, and robust electrical performance – all while meeting the strictest global restrictions on hazardous substances. Its eutectic composition provides a sharp melting point at 138 °C, enabling energy‑efficient reflow and protecting temperature‑sensitive components. With a powder particle size of 25–45 μm, this paste bridges the gap between Type 3 and Type 4 classifications, making it the ideal SnBi solder paste choice for both conventional and fine‑pitch SMT assembly lines.

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