TENSAN Electronic Encapsulant Adhesive TS6601 is semi-flow RTV silicone with good waterproof function and sealing strength. Electronic Encapsulant Adhesive can be used for bonding metal, glass, ceramics etc. material. REACH, ROHS certified MSDS for air/sea shipment Fast curing Non-corrosive to most Copper, Polycarbonate plastics material Excellent waterproof function Excellent sealing performance Good Performance for insulation
Epoxy AB Adhesive epoxy resin is an epoxy two-component adhesive. It is widely used for bonding, fixing, filling, heat conduction, electric conduction and so on of electronic products, electrical equipment, components and other products. After curing, it has the advantages of low expansion coefficient, high and low temperature resistance, shock resistance and vibration resistance, etc. Its viscosity, hardness, curing speed, thermal conductivity or electrical conductivity can be adjusted according to the needs of customers.
Epoxy AB Adhesive is an epoxy two-component adhesive. It is widely used for bonding, fixing, filling, heat conduction, electric conduction and so on of electronic products, electrical equipment, components and other products. After curing, it has the advantages of low expansion coefficient, high and low temperature resistance, shock resistance and vibration resistance, etc. Its viscosity, hardness, curing speed, thermal conductivity or electrical conductivity can be adjusted according to the needs of customers.