Let’s walk through the advantages of Tensan TS4108A. First, it is a one‑part epoxy that cures at elevated temperatures – ideal for PCB SMD bonding. Second, its thixotropic properties are excellent, allowing smooth, repeatable application by either dispensing or stencil printing, even on high‑speed equipment. Third, after heat curing, the adhesive achieves a high mechanical strength that reliably holds components in place. Fourth, the material is certified to REACH and RoHS standards, so you can confidently use it in global markets. Finally, it is easy to mix and use – in fact, it comes pre‑mixed, so no extra preparation is required.
Features & Benefits of Red Glue Adhesive for SMD TS4108A
Tensan SMD red glue 4108A is a one-component epoxy adhesive, curing at high temperature.
It is designed for SMD components on printed circuit board bonding. 4108A has suitable for high-speed SMT placement machine Dispensing and stencil printing.
It is of high adhesive strength after curing .
◆ REACH, ROHS, certified
◆ Excellent thixotropy
◆ Good adhesive strength after curing
◆ Easy to mix and use
Instructions and Precautions of Red Glue Adhesive for SMD TS4108A
Cold storage 4108A to be rewarmed before use, 30ml syringe to be 1 hour, 300ml 24 hours. Storage tank or dispensing mouth temperature at 25℃-30℃ can
help improve the high-speed dispensing effect.
Precautions of Red Glue Adhesive for SMD TS4108A:
1.In order to avoid contaminating unused glue, any glue can not be back into the original packaging.
2.Glue placing in the air will absorb trace moisture performance, which will influence the properties of glue, so it should be avoided. In the stencil printing,
do not put SMT printed circuit board in the air for too long,
patch curing as soon as possible, if possible, air humidity should be controlled.
Packing Information
30ml/syringe
200g/syringe
Storage andValidity
2-8℃, cool and dry place, it can be stored for 6 months; room temperature (25℃), it can be stored for 1 month.
Typical Properties of Red Glue Adhesive for SMD TS4108A
|
Item |
Index |
|
Specific Gravity (g/cm3) |
1.28 |
|
Viscosity at 5rpm 25℃ |
300.000cps |
|
Adhesive Strength ( 2125c) |
44N(4.5kgf) |
|
Adhesive Strength (Mini-mold tr) |
45N(4.6kgf) |
|
Adhesive Strength (SOP-IC 16P) |
92N(9.4kgf) |
|
Thixotropy Index |
6.3 |
|
Electric Property (Ω.cm) |
2.6*10^16 |
|
Resistance Insulation (Ω.cm) |
1.0*10^14 |
|
Resistance Initial Value (Ω.cm) |
1.2*10^12 |
|
Curing Condition |
150℃/60sec 130℃/90sec
|
|
Applying Method |
High -speed dispenser |
|
Dielectric Constant |
3.62/MHz |
|
Dielectric Loss Tangent |
0.013/1MHz |
|
Preservation Condition |
Refrigerated storage at 2-8℃ |
|
Package Style |
30ml/syringe 200g/syringe |
Other Information
The above information are correct, but does not contain all of the information and can only be used as a guide.
This product is ROHS, REACH, compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.
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