Silicone Dielectric Gel Clear

Silicone Dielectric Gel Clear

This product Silicone Dielectric Gel Clear is an aluminum shell, plastic tube single-component packaging of plastic materials, one additive silicone material can cure at room temperature or increasing heat.This two-component flexible silicone is designed for potting and protection of electronics in harsh conditions. The product is cured to form elastic cushioning material, which can reduce the mechanical stress and tension caused by mechanical, thermal shock and vibration, easy to repair, high-frequency electrical performance, solvent-free and no curing by-products.

Model:TS8877

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Product Description

Product Specifications

modelTS8877(Silicone Dielectric Gel Clear

1.Introduction

This product is an aluminum shell, plastic tube single-component packaging of plastic materials, one additive silicone material can cure at room temperature or increasing heat.This two-component flexible silicone is designed for potting and protection of electronics in harsh conditions. The product is cured to form elastic cushioning material, which can reduce the mechanical stress and tension caused by mechanical, thermal shock and vibration, easy to repair, high-frequency electrical performance, solvent-free and no curing by-products.

2.Characteristic

● An elastomer No hardness, no stress, with good shock resistance to shock

● Can be cured at room temperature or fast curing when increasing heat, almost non-shrinkage

● High-frequency electrical performance is stable, solvent-free, no curing by-product release

● Repairable

3.Typical Application

Cushioning of precision electrical and electronic components, seismic protection

4.Technical performance    Before curing:   


 Silicone Dielectric Gel Clear


Test items

standard

unit

A component

B component

Exterior

Visual

---

clear

clear

Viscosity

GB/T 2797-1995

mPa·s25℃

500

500

Density

GB/T 13354-92

g/cm325℃

0.97

0.97


Operating process:

 Items

Unit / condition

Value

mixing ratio

weight ratio

11

Operable time

min25℃

6090

Curing time

H/℃

0.5/80

Color after curing

Visual

clear

After curing:

Items

standard

unit

Value

Hardness

GB/T 531-83

Shore A

0

Volume resistivity

GB/T 1410-2006

DC500VΩ· cm3

1.0×1014

Dielectric strength

GB/T 1698-2005

kV/mm25℃

>15

Temperature range

-60200

Note: All data above is measured after curing for 7 days at 25 ° C, 55% RH. 

5.nstructions

1.Mixing

The product is supplied in two packs, mixing Part A and Part B in the specified weight ratios. After the A component and the B component are thoroughly mixed, gently agitate to reduce the amount of air mixed. The mixed material is allowed to stand for 5 minutes before pouring, which is advantageous for removing the air mixed in during mixing. If you still have bubbles, you need vacuum degassing. Taking into account the expansibility of the material, the volume of the degassing vessel used should be at least 4 times the volume of the liquid. Vacuum bubbles from 28 to 30 inches of mercury can be used to remove air bubbles contained in the mixed material. Continue to vacuum until the liquid expanded and then returned to its original volume, the bubble will be completely eliminated. This process can take anywhere from 5 minutes to 10 minutes, depending on the amount of air entrained during mixing. In order to achieve the best curing effect, it is necessary to use glassware and glass or metal mixing equipment. Try to keep it steady while mixing to prevent mixing with excess air.

2.The applicable period / operating time

The curing reaction starts at the beginning of the mixing process. The initial curing phenomenon is the gradual increase in viscosity, and finally become a flexible gel. The pot life is defined as the time it takes for the viscosity to increase twice as long after the components A and B (main and curative) are mixed. Please refer to the operation time of each model product.

3.Processing and curing

After the product has been thoroughly mixed, it can be directly injected / dispensed into the parts requiring curing for curing. Take care to minimize the air mix. If practicable, especially potting components have many micro-holes, should be as far as possible under vacuum plastic environment. If you can not use this technology, the components should be vacuum degassing after using the product potting. The product can be cured either at room temperature (25 ° C) or thermally. Product specifications listed in the product ideal curing conditions. The product should be pre-agitated before use because of the partial precipitation that can occur during shipping and storage.

4.Preparation of the surface

Before use, the surface of the components to be encapsulated, coated or glued is cleaned to remove the oil and other impurities on the surface (can be washed with organic solvents such as alcohol and acetone).

5.Available temperature range

For most applications, the product can be long-term use in the temperature range of -60 to 200 ℃. However, under the condition of low temperature and high temperature, the performance performance of the product in some special applications can become very complicated, so additional factors need to be taken into consideration. In terms of low temperature performance, although the heat cycle can be carried out at about -60 ° C, the performance of your parts and assemblies needs to be verified. Factors that affect performance include the configuration and stress sensitivity of the part, the cooling rate and residence time, and the temperature history previously experienced. For example, the special material of Tensan Potting Elastomer can be used at a temperature of -60 ℃ or lower. Under high temperature conditions, the cured product durability depends on the time and temperature. As expected, the higher the service temperature, the shorter the product can be used.

6.Compatibility

In some cases, this product will not be able to achieve the desired cure when in contact with certain plastics or rubbers. Solving this problem may be accomplished by cleaning the surface of the substrate with a solvent or baking slightly above the cure temperature.

Some chemicals, curing agents plasticizers will inhibit the curing, the following materials pay special attention to: organic compounds containing N, P, S and other ionic compounds containing Sn, Pb, Hg, Bi, As; Vinyl compounds; condensation compounds and their contaminated molds and tools.

7.Repairable

When producing electrical / electronic equipment, it is hoped that the waste or damaged product can be recycled. Without significant damage to the internal circuitry, it is difficult or impossible to remove and re-fill non-silicone rigid potting materials. The use of Tensan silicone sealant can be easily and selectively removed, repaired or completely replaced, and re-poured into a new potting compound at the repaired site.

When removing the silicone elastomer, unwanted material can simply be torn off or removed from the area to be repaired using a sharp blade or knife. For the elastomer adhered to the part, it is best to remove it from the substrate or the circuit by mechanical methods such as scraping or rubbing.

Before re-filling the repaired parts with potting compound, sand the surface of the cured potting compound with sandpaper and wipe it with a suitable solvent. This helps to increase the cohesion, combining the repaired material with the existing potting compound. Silicone primer should not be used as the product's own adhesive.

8.Operational precautions

1. Before use, please stir, especially up and down mixing;

2.Skin contact with plastic soap and water rinse to clean, if you accidentally come into contact with the eyes, immediately rinse the eyes with plenty of water for at least 15 minutes, if the pain should be immediately medical treatment;

3. This information does not include the safety information required for the safe use of this product. Before use, please read the product and its safety data sheet as well as the container label for safe use of the product and physical and health hazard information available from TINEN.

4.A, B components in the original packaging must be stirred with a stirring device for 2-5 minutes, to avoid the transport of stratification caused by the deposition of the product effect.

9Storage and shelf life

Products that are in an unopened, sealed condition have a shelf life of 6 months at 25 ° C in the dark (calculated on the date of manufacture on the product).


10.Package

1.A component: 20kg / barrel, B component: 20kg / barrel

2.A component: 10kg / barrel, B component: 10kg / barrel

3. Need other packaging, please inform us before.

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