SMD Bonding Paste

Tianshan TS4109B is a ready-to-use, thermosetting epoxy designed to streamline the surface mount process. Its unique low-temperature curing mechanism makes it the preferred choice for high-output SMT lines where cycle time and component integrity are paramount. The formulation is optimized for both manual and automated dispensing, with a distinct advantage in stencil printing.

Key Features & Benefits

• Energy-Saving Curing: Achieves acceptable bond strength at relatively low temperatures, reducing energy consumption and protecting heat-sensitive board materials.
• Non-Drip Formula: The precise viscosity control eliminates tailing and stringing, ensuring a clean application every time.
• High Insulation Resistance: Maintains excellent dielectric properties even under humid conditions, preventing leakage currents in densely populated boards.
• Long Pot Life: The 48-hour working window provides significant flexibility for shift changes and unexpected production stoppages.
• Excellent Solderability: Does not contaminate the solder paste or affect the wetting characteristics during reflow or wave soldering.

Material Properties (Before Curing)

Material Properties (After Curing)

Thermal & Aging Performance

• Long-Term Durability: Data shows that the adhesive maintains over 90% of its initial strength even after 1000 hours of dry heat exposure.
• Aging Test Results (Adhesion Retention Rate):

Packaging

Standard Packaging: 30ml/unit, 200g/unit, 360g/unit, or as per the customer's packaging request.

Storage & Handling

• Cold Chain: A strict 2°C to 8°C cold chain is mandatory for the full 6-month shelf life.
• Thawing Protocol: Always return the adhesive to ambient conditions prior to opening. Small syringes (20-30ml) require 2-4 hours, while larger packs (200g-360g) require 4-6 hours at 25±3°C. Never use microwave or hot-water baths for rapid thawing.
• Contamination Control: It is imperative to avoid cross-contamination; therefore, never pour unused material back into the master container. Moisture pickup from the atmosphere degrades performance; consequently, exposed adhesive should be discarded. Ensure components are placed and cured promptly after dispensing.