Tensan TS4108A SMD Red Glue is a one‑part, high‑temperature curing epoxy adhesive formulated for bonding surface‑mount devices (SMD) to printed circuit boards (PCBs). It exhibits excellent thixotropic properties, making it fully compatible with both dispensing and stencil printing processes on high‑speed SMT assembly lines, ensuring clean, precise deposition without sagging or stringing. After heat curing, the adhesive delivers high bond strength that securely holds components in place, resisting thermal shock and mechanical vibration during subsequent soldering and handling.
Features & Benefits of SMD Red Glue Adhesive TS4108A
Tensan SMD red glue 4108A is a one-component epoxy adhesive, curing at high temperature.
It is designed for SMD components on printed circuit board bonding. 4108A has suitable for high-speed SMT placement machine Dispensing and stencil printing.
It is of high adhesive strength after curing .
◆ REACH, ROHS, certified
◆ Excellent thixotropy
◆ Good adhesive strength after curing
◆ Easy to mix and use
Instructions and Precautions of SMD Red Glue Adhesive TS4108A
Cold storage 4108A to be rewarmed before use, 30ml syringe to be 1 hour, 300ml 24 hours. Storage tank or dispensing mouth temperature at 25℃-30℃ can
help improve the high-speed dispensing effect.
Precautions of SMD Red Glue Adhesive TS4108A:
1.In order to avoid contaminating unused glue, any glue can not be back into the original packaging.
2.Glue placing in the air will absorb trace moisture performance, which will influence the properties of glue, so it should be avoided. In the stencil printing,
do not put SMT printed circuit board in the air for too long,
patch curing as soon as possible, if possible, air humidity should be controlled.
Packing Information
30ml/syringe
200g/syringe
Storage andValidity
2-8℃, cool and dry place, it can be stored for 6 months; room temperature (25℃), it can be stored for 1 month.
Typical Properties of SMD Red Glue Adhesive TS4108A
|
Item |
Index |
|
Specific Gravity (g/cm3) |
1.28 |
|
Viscosity at 5rpm 25℃ |
300.000cps |
|
Adhesive Strength ( 2125c) |
44N(4.5kgf) |
|
Adhesive Strength (Mini-mold tr) |
45N(4.6kgf) |
|
Adhesive Strength (SOP-IC 16P) |
92N(9.4kgf) |
|
Thixotropy Index |
6.3 |
|
Electric Property (Ω.cm) |
2.6*10^16 |
|
Resistance Insulation (Ω.cm) |
1.0*10^14 |
|
Resistance Initial Value (Ω.cm) |
1.2*10^12 |
|
Curing Condition |
150℃/60sec 130℃/90sec
|
|
Applying Method |
High -speed dispenser |
|
Dielectric Constant |
3.62/MHz |
|
Dielectric Loss Tangent |
0.013/1MHz |
|
Preservation Condition |
Refrigerated storage at 2-8℃ |
|
Package Style |
30ml/syringe 200g/syringe |
Other Information
The above information are correct, but does not contain all of the information and can only be used as a guide.
This product is ROHS, REACH, compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.
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