SMT Epoxy Adhesive

The TS4109B is a single-component, thermally accelerated epoxy resin system developed by Tianshan to meet the rigorous demands of modern SMT assembly. Engineered specifically for stencil printing, this red paste exhibits exceptional sag resistance, ensuring consistent deposit geometry even on thick-core boards and fine-pitch patterns.

Key Features & Benefits

• Rapid Low-Temperature Cure: Reaches handling strength in just 90–120 seconds at 120°C, which minimizes thermal stress on sensitive ceramic capacitors and ICs.
• Superior Rheology: The pseudoplastic flow behavior guarantees clean release from the stencil aperture and prevents cold-slumping after printing.
• Robust Green Strength: Secures components firmly against vibration and thermal shock during wave soldering processes.
• Extended Open Time: Maintains its application properties for up to 48 hours under controlled shop-floor conditions.
• Halogen-Free Formulation: Designed to meet modern environmental compliance standards without compromising adhesion.

 Material Properties (Before Curing)

Material Properties (After Curing)

• Temperature Endurance: The cured thermoset network provides stable adhesion across a wide operating temperature range.
• Aging Test Results (Adhesion Retention Rate):

Packaging

Standard Packaging: Available in 30ml syringes, 200g cartridges, 360g cartridges, or tailored to specific customer volume requirements.

Storage & Handling

• Storage: To preserve reactivity, the adhesive must be kept in cold storage at 2°C to 8°C, offering a shelf-life of up to 6 months.
• Conditioning Prior to Use: Frozen or cold product must be fully acclimatized to room temperature. For 20-30ml syringes, allow 2-4 hours at 25±3°C; for larger 200-360g containers, extend this to 4-6 hours. Forced heating is strictly forbidden as it may cause premature polymerization.
• Floor Life Management: The working environment should ideally be controlled at 25±3°C and 50-70% RH. Once the container is opened, avoid leaving the paste exposed to humid air. Discard any unused exposed residue rather than returning it to the original packaging.