Stencil-Ready SMT Adhesive
  • Stencil-Ready SMT Adhesive Stencil-Ready SMT Adhesive
  • Stencil-Ready SMT Adhesive Stencil-Ready SMT Adhesive
  • Stencil-Ready SMT Adhesive Stencil-Ready SMT Adhesive

Stencil-Ready SMT Adhesive

Model:TS4109B

The TS4109B is an economical yet high-performance SMD adhesive solution. By combining low-temperature curing with extended floor life, Tianshan has created a product that reduces energy costs and material waste. Its consistent printing properties ensure fewer rejected assemblies, thereby optimizing the overall cost of ownership.

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Product Description

The TS4109B is an economical yet high-performance SMD adhesive solution. By combining low-temperature curing with extended floor life, Tianshan has created a product that reduces energy costs and material waste. Its consistent printing properties ensure fewer rejected assemblies, thereby optimizing the overall cost of ownership.

Key Features & Benefits


  • Reduced Energy Footprint: Lower curing temperatures result in significant electricity savings over the production lifecycle.
  • Minimal Scrap Rate: The adhesive's long working time reduces the frequency of stencil cleaning and material disposal.
  • Maximized Print Yield: Perfect for thick board printing where uniform deposit thickness is critical for strong bonding.
  • Lean Manufacturing Friendly: The 48-hour stability allows for just-in-time manufacturing without freezing or thawing delays.
  • Versatile Application: Compatible with pneumatic dispensers, time-pressure guns, and automated stencil printers.


Material Properties (Before Curing)


Curing Conditions

The recommended curing profile is 120°C for 90 to 120 seconds. For optimal performance, the adhesive can also achieve cure at lower temperatures with extended time:

105°C: 10 minutes (achieves ~97.6% curing strength).

120°C: 2 minutes (achieves ~68% strength) / 4 minutes (achieves ~92.5% strength).Note: Actual heating time in production may be longer due to the pre-heating phase.

Material Properties (After Curing)


Thermal & Aging Performance

Cost-Effective Longevity: Despite its economical profile, the adhesive sustains bond strength well over extended thermal aging.

Aging Test Results (Adhesion Retention Rate):

Packaging

Standard Packaging: 30ml syringe, 200g cartridge, 360g cartridge, or bespoke quantities by request.

Storage & Handling

Cold Storage: Keep refrigerated at 2-8°C; 6-month shelf-life guaranteed if unopened.

Conditioning: It is vital to restore room temperature (25±3°C) prior to opening. Small packages need 2-4 hours; large format packs require 4-6 hours. Do not use quick-heating methods to preserve rheological stability.

Housekeeping: Maintain the work area at 25±3°C and 50-70% RH. Since open containers absorb moisture, they should be sealed immediately after use. Under no circumstances should leftover paste be poured back into the primary container, as this compromises the entire batch's shelf life.









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