Thixotropic Printing Adhesive

For manufacturers demanding zero-defect assembly, the Tianshan TS4109B offers a reliable bonding solution that survives rigorous environmental stress testing. This epoxy is specially formulated to withstand the thermal shocks of both soldering and end-use environments, providing exceptional mechanical support for miniature SMDs.

Key Features & Benefits

• Proven Thermal Shock Resistance: Successfully passes the 260°C solder float test without component loss, ensuring process yield.
• Consistent Thixotropy: Guarantees the same printing performance over the 48-hour working period, reducing process variables.
• High Purity: Low ionic contamination levels ensure excellent surface resistance even under biased humidity testing.
• Dimensional Stability: The low CTE (below 80 ppm before Tg) minimizes thermal mismatch with FR4 substrates.
• Controlled Granularity: The 10-15μm particle size prevents stencil abrasion and promotes uniform distribution.

Material Properties (Before Curing)

Curing Conditions

The recommended curing profile is 120°C for 90 to 120 seconds. For optimal performance, the adhesive can also achieve cure at lower temperatures with extended time:

• 105°C: 10 minutes (achieves ~97.6% curing strength).
• 120°C: 2 minutes (achieves ~68% strength) / 4 minutes (achieves ~92.5% strength).

Note: Actual heating time in production may be longer due to the pre-heating phase.

Material Properties (After Curing)

Thermal & Aging Performance

Quality Verification: The adhesive has passed long-term reliability checks with adhesion retention rates confirming robust cross-linking.

Aging Test Results (Adhesion Retention Rate):

Packaging

Standard Packaging: Supplied in 30ml, 200g, or 360g containers, or available in custom sizes per client request.

Storage & Handling

• Shelf Life: 6 months when continuously stored in a cold room (2°C to 8°C).
• Return to Room Temperature: Prior to dispensing, the material must be warmed to 25±3°C. Timing: 2-4 hours for smaller syringes and 4-6 hours for larger cartridges. Thawing by heat gun or oven is strictly prohibited.
• Workplace Environment: Temperature should be maintained at 25±3°C and humidity at 50-70% RH. Exposed surfaces attract moisture; thus, any adhesive remaining on the stencil should be cleaned regularly. Do not return used material to the original container to prevent the risk of contamination.