Exhibition information

TENSAN at NEPCON Vietnam 2024 to explore infinite possibilities

2024-09-11

In the wave of technology and innovation, adhesive, as the key material for connection and solidity, is gradually becoming an important force to promote the development of the electronics industry. With the approach of NEPCON Vietnam 2024, the elites of the global adhesives industry are ready to show their latest achievements and plan for the future of the industry in this technological feast.


Vietnam, as an economic star in Southeast Asia, has risen to prominence in the field of electronics manufacturing in recent years, with its cost advantages, policy support and perfect industrial chain layout, attracting many internationally renowned enterprises to invest in factories. NEPCON Vietnam 2024 Fair, as an important platform for connecting the global electronics industry chain, not only gathers the world's newest electronic products, technological solutions and innovative applications, but also provides a platform for adhesive enterprises to showcase themselves and make a good contribution to the future of the industry. It also provides an excellent opportunity for adhesive enterprises to showcase themselves and connect with customers.


For TENSAN, participating in this exhibition means entering a new world full of opportunities and challenges. With the development of electronic products in the direction of miniaturisation, lightweight and high performance, the performance requirements for adhesives are becoming more and more stringent, TENSAN will join hands to bring a series of high-performance adhesive products tailor-made for the electronics industry, including but not limited to high temperature resistance, conductive and thermally conductive, fast curing, environmentally friendly non-toxic and other characteristics of the innovative products, designed to solve the electronics industry in the assembly, sealing, thermal conductivity, electromagnetic shielding and other technical challenges. Technical difficulties in assembly, sealing, thermal conductivity, electromagnetic shielding and other aspects of the electronics industry.


During the exhibition, TENSAN will not only display the advantages of its products through its carefully arranged booths, but also organise technical seminars, on-site demonstrations and other activities to have in-depth exchanges with industry experts, buyers and end-users from all over the world, and to discuss the latest trends and challenges of the application of adhesives in the electronics field. At the same time, this is also a valuable opportunity to observe market dynamics, collect industry information, and find partners, which will help enterprises grasp the future development direction and accelerate technological innovation and industrial upgrading.


Looking ahead, with the continued prosperity of the electronics industry and the continuous progress of technology, the adhesive industry will usher in a broader space for development. NEPCON Vietnam 2024 will be an important stage for adhesive enterprises to demonstrate their strength, expand the market and deepen cooperation. We look forward to witnessing the blooming of adhesive technology in this technological feast, and jointly promote the electronics industry towards a more brilliant tomorrow.


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