TS8866 potting compound with 1.0 W/m・K high thermal conductivity, 1:1 two-component ratio, suitable for power converters, PCB boards, and LED driver packaging. It cures quickly at room temperature, has excellent flowability, and can fully fill tiny gaps to form a seamless protective layer. After curing, it is resistant to high and low temperatures and thermal shock, with stable thermal conductivity, accelerating heat dissipation and improving equipment stability; it is also waterproof and flame retardant, ensuring safe use. Free samples are available; direct factory sales for bulk orders, with preferential pricing for large quantities.
Packing Information:
10kg/bucket; 20kg/bucket; 25kg/bucket
Features & Benefits
Two-component silicone potting, 1 to 1, curing at room temperature.
◆ REACH, ROHS, UL VO certified
◆ Good waterproof
◆ Good thermal conductivity
◆ Easy to mix and use
Application
◆ Power moduls
◆ Adaptors
◆ Transformers
◆ Ballasts
◆ Sensors
◆ Electric control units product
Typical Properties
TS8833 High Thermal Conductivity & UL94 V-0 Flame-Retardant Potting Compound 1:1 – Heavy-Duty Encapsulant for LED Drivers & ConvertersTS8800 Economical 1:1 Two-Part Silicone Potting Compound – Thermal Conductive Waterproof Encapsulant for LED Drivers, Bulk Price
TS8811 1:1 Two-Part Thermal Potting Silicone (0.6 W/m·K) – Flame-Retardant V1 Encapsulant for LED Drivers & Power Modules, Free Sample
TS8822 Easy-Mix Thermal Potting Compound – High Performance Encapsulant for LED Driver & Electronic Modules, Competitive Price