Shenzhen Tensan is a professional manufactures of Thermal Grease. There may be a lot of Thermal Grease manufacturers out there, but not all Thermal Grease manufacturers are alike.Our professional expertise in manufacturing Thermal Grease has been honed over the past 10+ years.
Thermal potting is suitable for general potting material for power supplies, connectors, sensors, industrial controls and transformers.
Termal potting Two-part, 1 to 1 mix, dark gray, general purpose encapsulant with good flowability and flame resistance.
High performance neutral cure electronic silicone adhesive/sealant,One-part adhesive/sealant • Cures at room temperature when exposed to moisture in the air • Alkoxy cure system • Non-sag, paste consistency • Easy to apply • Cures to a tough, flexible rubber • Excellent adhesion to many substrates.
Shenzhen Tensan is a professional manufactures of Thermal Grease. There may be a lot of Thermal Grease manufacturers out there, but not all Thermal Grease manufacturers are alike.Our professional expertise in manufacturing Thermal Grease has been honed over the past 10+ years.
Thermal grease is suitable for use as an interface material for a variety of mid to high end PCB system assemblies. Tensan thermally paste are grease like silicone materials, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compounds are designed to maintain a positive heat sink seal to improve heat transfer from the electrical device or PCB system assembly to the heat sink or chassis, thereby increasing the overall efficiency of the device.
There may be a lot of Silicone Elastomer manufacturers out there, but not all Silicone Elastomer manufacturers are alike.Our professional expertise in manufacturing Silicone Elastomer has been honed over the past 10+ years.
Silicone Elastomer is suitable for: • LED Lighting encapsulation • Power supplies • Connectors • Sensors • Industrial controls • Transformers • Amplifiers • High voltage resistor packs • Relays • Adhesive/encapsulant for solar cells • Adhesive handling beam lead integrated circuits during processing
In July 2026, TENSAN released a technical guide on encapsulation compound selection, systematically analyzing the performance differences and selection logic of three major systems—silicone, epoxy, and polyurethane—along with specialty compounds, aiming to help engineers in electronics, new energy, and automotive industries make scientific material choices and drive the evolution of packaging materials toward functional and intelligent solutions.
Silicone potting compounds provide flexible, durable protection for electronic assemblies. TENSAN offers a comprehensive range of formulations, but choosing the right one requires evaluating your specific application needs.
The market offers a wide variety of one-component adhesives, primarily including silicone, epoxy resin, phenolic resin, and nitrile rubber. Among these, silicone and epoxy products are the most widely used. Different application environments, production processes, and bonding substrates vary significantly, resulting in different suitable adhesive models. This article, based on TENSAN's product application experience, provides a detailed analysis of the core performance differences between one-component silicone and epoxy adhesives, offering industry users precise and practical adhesive selection solutions.