In the manufacturing industry, thermal paste is a commonly used material that possesses both heat dissipation and insulation properties, belonging to the category of heat-dissipating and non-conductive functional materials. This material requires precise application techniques, with thin and even application being the core principle. Based on this, this article will explain the dangers of excessive thermal paste application and provide corresponding solutions.
As electronic devices become increasingly sophisticated and their applications more diverse, circuit boards, as core components, directly determine the reliability and lifespan of the equipment. Solder wires and solder joints are critical nodes for signal transmission and power conduction, and proper reinforcement and protection are essential to ensuring stable equipment operation. Scientific adhesive selection is a core aspect of this process.
Thermal conductive encapsulants and thermal conductive greases are widely used adhesives in electronic products. They not only provide efficient heat dissipation but also offer waterproofing, moisture resistance, and excellent insulation. The protection provided by these thermal materials improves the stability, performance, and lifespan of electronic products.
Silicone sealant is a high-performance bonding and sealing material widely used in many fields. It can bond a variety of materials, including but not limited to glass, metal, ceramics, plastics, concrete, and wood. Silicone sealants have excellent high and low-temperature resistance, weather resistance, water resistance, and elasticity, making them suitable for various indoor and outdoor environments.
Silicone potting compound is a potting material with organic silicon polymer as the main component, and it has the following significant advantages:
In today's rapidly developing electronics industry, Silicone Pottings have become a key material for ensuring the stable operation of electronic equipment. With their superior comprehensive performance, they build an all-around protective barrier for various precision electronic components.
