Thermal grease is a crucial thermal conductive material in electronic and electrical equipment. Although used in small quantities, it directly affects the heat dissipation efficiency of the equipment. Insufficient or substandard products can easily lead to equipment failure and significantly shorten its lifespan. Therefore, selecting high-quality thermal grease is paramount. TENSAN specializes in thermal conductive materials and focuses on the research and development of thermal grease, providing customized application solutions. Its products are suitable for various industries including new energy, military, medical, aerospace, shipbuilding, automotive, high-speed rail, general electronics, instrumentation, and power supplies.
The adhesive industry is diverse, with different brands and specifications exhibiting significant differences in adhesive performance and applicable scenarios. Sealants, based on their curing methods, can be broadly categorized into silicone and two-component sealants. These differ in curing principles, application methods, and application areas, catering to various usage needs. Among various sealants, silicone sealants, due to their stable overall performance, are widely used across multiple industries, and their adhesive performance and core performance characteristics are of great interest.
Silicone potting are widely used functional adhesives in the electronics industry. With their excellent thermal conductivity, heat dissipation, waterproofing, moisture resistance, and electrical insulation, they provide comprehensive protection for electronic devices, effectively improving operational stability, performance, and lifespan. They are suitable for various complex operating conditions and the protection needs of precision electronic components.
High-quality sealants must possess two core characteristics: low viscosity and strong adhesion. Low viscosity effectively extends application time and reduces material waste; excellent adhesion ensures tight bonding to the substrate surface, significantly improving sealing and fixing effects.
Many people are unclear about the actual use of thermal paste. It primarily fills the tiny gaps between heat dissipation devices and heat-generating chips, sealing the contact surfaces and significantly improving heat conduction efficiency. This allows heat dissipation components to fully utilize their heat dissipation capabilities, contributing to stable heat dissipation of electronic components.
For high-power components, using electronic potting compounds is not optional, but a crucial prerequisite for ensuring their stable operation. Air has a thermal conductivity of only 0.024 W/(m·K), resulting in extremely poor heat dissipation. If high-power components rely solely on natural air cooling, heat cannot be effectively conducted away, easily leading to localized high temperatures. This high-temperature environment directly damages components and related parts, significantly reducing the reliability of the entire electronic system and shortening its normal operating life. Therefore, the appropriate selection of electronic potting compounds is essential for the stable operation of high-power components.