Shenzhen Tensan Co., Ltd.– With the continuous improvement of material performance requirements in the field of industrial manufacturing, Shenzhen Tensan Co., Ltd., as a professional industrial glue manufacturer, officially launched a new generation of high-performance potting adhesive series products. With its excellent sealing, weather resistance and electrical insulation properties, the product provides reliable solutions for electronics, automotive, new energy and communication equipment industries.
Efficient and precise, instant bonding! Shenzhen Tiansan Co., Ltd. launched cyanoacrylate 406 to empower a new experience in industrial manufacturing Curing in seconds, super sticky, 406 cyanoacrylate provides an excellent solution for precision manufacturing and rapid repair
Shenzhen, China – Shenzhen Tiansan Co., Ltd, a leading manufacturer of industrial glues, today announced the launch of its latest high-performance Solder Paste product. Designed specifically for the electronics manufacturing industry, this product is designed to meet the needs of high-precision soldering, providing superior soldering solutions for PCB assembly, SMT (surface mount technology) and other precision electronics manufacturing processes
With the continuous expansion of electronic equipment application scenarios, coating, as a key material for circuit board protection, has become the focus of industry attention for its standardization and accuracy of manual glue application. Recently, a number of electronic manufacturing companies jointly revised and released a new version of the "Manual Coating Glue Application Specifications", emphasizing the optimization of details in the entire process from pretreatment to curing to improve product protection performance and production efficiency.
Tensan 4108A is a one-component epoxy adhesive, curing at high temperatures. It is designed for SMD components on printed circuit board bonding. 4108A is suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing.
