TS8822 High-Performance, Easy-Mix Potting Compound: A 1:1 two-component design suitable for LED driver and power module packaging. It cures quickly at room temperature, resulting in high production efficiency. After curing, it is flexible, crack-resistant, and highly resistant to thermal shock. It offers stable thermal conductivity, effectively transferring heat from components and preventing high-temperature damage. It also boasts high waterproof and dustproof ratings, resisting harsh outdoor environments. Factory direct supply eliminates intermediaries; free samples are available, and bulk purchases enjoy greater discounts.
Packing Information:
10kg/bucket; 20kg/bucket; 25kg/bucketFeatures & Benefits
Two-component silicone potting, 1 to 1, curing at room temperature.
◆ REACH, ROHS, certified
◆ Good waterproof
◆ Good thermal conductivity
◆ Easy to mix and use
Application
◆ Power moduls
◆ Adaptors
◆ Transformers
◆ Ballasts
◆ Sensors
◆ Electric control units product
Typical Properties
TS8833 High Thermal Conductivity & UL94 V-0 Flame-Retardant Potting Compound 1:1 – Heavy-Duty Encapsulant for LED Drivers & ConvertersTS8800 Economical 1:1 Two-Part Silicone Potting Compound – Thermal Conductive Waterproof Encapsulant for LED Drivers, Bulk Price
TS8811 1:1 Two-Part Thermal Potting Silicone (0.6 W/m·K) – Flame-Retardant V1 Encapsulant for LED Drivers & Power Modules, Free Sample
TS8866 High Thermal Conductivity Potting Silicone 1.0 W/m·K – Waterproof Flame-Retardant Encapsulant for Power Converters & PCB