TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant
  • TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant
  • TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant
  • TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant

TS5505L Thermal Conductive Adhesive 1.3W/m·K, Specialized for LED Lighting, Quick Dry & 150℃ High Temp Resistant

Model:TS5505L

LED-optimised 1.3W/m·K Thermal adhesive: Engineered for COB LEDs, downlights & high-brightness fixtures. Thermal interface minimises hotspot formation in high-density arrays. 0.8 MPa shear strength. Low volatility (<0.1%) prevents lens fogging.

  • Packing Information:

    100ML/PCS, 300ML/PCS, 2600ML/PCS

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Product Description

 Features & Benefits

TENSAN TS5505L is thermally adhesive with heatsink and sealing strength. Thermallly conductive silicone is mainly used for electronic industry to bond two items or fill gap and conduct the heat.

◆  REACH, ROHS certified

◆   MSDS for air/sea shipment

◆   Non-corrosive to most metal material

◆   Excellent thermal conductivity

◆   Good resistance in change of hot and cold temp

◆   Good Performance for insulation  


Typical Applications

This material is widely applied in electronics products like consumer electronics, power supply , lamp devices etc.

◆   Used to replace thermal grease for CPU and its heat sink conductor

◆  To use in SCR intellectualized control module and its radiator

◆   Use to fill the gap between electronic module and radiator and make heat conduct


Typical Properties 



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