TS-350 is a widely used, lead-free, no-clean solder paste. QFN-350 solder paste offers performance similar to that of tin-leadprocesses. TS-350 solder paste achieves theindustry‘s best head rest defect resistance and first pass yields on in-line testing. TS-350demonstrates excellent print performance, especially in applications with ultra-fine pitch repeatability (11 mil square) and high yield requirements.
Soleder Paste TS350 Product Details:
Alloy: SAC305 (96.5%Sn/3.0%Ag/0.5%Cu) For other alloys, please contact your local Tensan sales office.
Powder size:
Powder No. 4 (20-38μm, according to IPC J-STD-005)
Residue: approx. 5% (w/w)
Package sizes: 500 gram cans, 6" and 12" sticks, DEK ProFlo® boxes and 10cc and 30cc tubes.
Fluxes: TS-350 fluxes are available in 10cc and 30cc tubes for rework applications.
Lead Free System: Compliant with RoHS Directive 2002/95/EC.
Product Description:
TS-350 is a widely used, lead-free, no-clean solder paste. QFN-350 solder paste offers performance similar to that of tin-leadprocesses.
TS-350 solder paste achieves theindustry‘s best head rest defect resistance and first pass yields on in-line testing.
TS-350demonstrates excellent print performance, especially in applications with ultra-fine pitch repeatability (11 mil square) and high yield requirements.
Product Application:
Formulated for both standard and fine pitch stencil printing, at print speeds of between 25mm/sec (1”/sec) and 150mm/sec (6”/sec), with stencil thickness of 100μm (4 mil) to 150μm (6 mil), particularly when used with ALPHA® Stencils. Blade pressures should be 0.18-0.27 kg/cm of blade (1.0 -1.5 Ibs/inch), depending upon the print speed. The higher the print speed employed, the higher the blade pressure that is required. The reflow process window will give high soldering yield with good cosmetics and minimized rework.
Product Storage:
Although TS-350 is not toxic, its typical reflux process produces a small amount of reaction and vapor decomposition. TS-350 should be stored in a refrigerator at 0-10C (32-
50° F).
TS-350 solder paste can be kept at room temperature before opening the package for use, which helps prevent condensation on the surface of the paste.
Feature & Benefits:
- High-quality printing applicable for small pitch pads.
- Stable viscosity during continuous printing.
- Good shape retention after printing.
- Excellent soldering performance.
- Little residue after soldering.
- Good ICT test performance.
- Suitable for paste in hole process.
Product Shelf Life:
Three Month
Package&Shipping
Each bottle is 500g, packed in wide-mouth plastic (PE) bottles, and sealed with an inner lid, which can be packed in a foam box for delivery, with a maximum of 20 bottles per box, and the temperature inside the box does not exceed 35°C.