Thermal Paste's Thermal Conductivity and Correct Application Method

Many people are unaware of the actual function of thermal paste: the contact surface between heat-generating components such as CPUs and chips and the heatsink is not perfectly flat; tiny gaps, barely perceptible to the naked eye, are filled with air, which has extremely poor thermal conductivity. Applying thermal paste between them perfectly fills these gaps, expelling air and creating an efficient heat conduction channel, allowing heat to be quickly conducted from the heat-generating component to the heatsink, fully utilizing the heat dissipation capacity of the heatsink.

Is the thermal conductivity of thermal paste important?

The heat dissipation assistance function of thermal paste is crucial and cannot be ignored. Without the filling and thermal conduction of thermal paste, an insulating air layer exists between the heatsink and the hardware, significantly reducing heat dissipation efficiency. This can easily lead to high-temperature malfunctions, throttling, and, with prolonged high-temperature operation, accelerate the aging of electronic components and shorten the lifespan of the equipment. High-quality thermal paste possesses stable thermal conductivity, high-temperature resistance, and resistance to drying and volatilization, making it suitable for various scenarios such as electronics, new energy, automotive, and industrial control equipment. It effectively stabilizes the operating temperature of equipment, ensuring long-term stable hardware operation.

Correct Application Method for Thermal Paste

Many beginners are accustomed to applying thermal paste in circular motions. This method easily leads to uneven thickness and residual air bubbles, severely affecting heat conduction. The correct method is simple and easy to follow:

1. Squeeze out an appropriate amount of thermal paste from the center of the chip or CPU. Do not use too much.
2. Using a plastic card, scraper, or other flat tool, spread the paste evenly from the center outwards.
3. Create a thin, smooth, and fully covering layer on the contact surface, without any obvious gaps or build-up.
4. Wipe away any excess thermal paste from the edges promptly to avoid contaminating the circuit board and causing a short circuit. 

Precautions for using thermal paste:

1. Ensure the coating is uniform, free of impurities and bubbles. Clean up excess paste promptly to keep the contact surface smooth and clean.
2. Standard thermal paste is a non-curing material. After application, the heatsink can be installed directly. Installation pressure will ensure a tighter adhesion and better thermal conductivity.
3. There is no need to be particular about the application technique. The core principle is a thin, uniform layer, free of bubbles.
4. Follow the principle of "the thinner the better." A uniform, thin layer provides stronger thermal conductivity, improving heat dissipation performance, reducing material waste, and controlling usage costs.