Potting Compound Selection Guide: Comparison and Applications of Silicone, Epoxy, and Polyurethane

Selecting the right potting material for electronic assemblies is critical to ensuring long-term stability and reliability. The three mainstream potting materials on the market today are silicone, epoxy resin, and polyurethane. Each has its own advantages and disadvantages in terms of chemical structure, physical properties, and cost, making them suitable for different application scenarios. TENSAN offers a comprehensive range of potting solutions covering all three material systems, helping you precisely match the optimal product based on your specific application requirements.

Application Scenario Quick Reference Table

Processing Tips

• Accurate mixing ratio: Two-component systems must be mixed strictly according to the recommended ratio. Deviations may result in incomplete curing or degraded performance.

• Vacuum degassing: Removing air bubbles through vacuum degassing after mixing prevents voids that can compromise insulation and thermal conductivity.

• Curing procedure: Strictly follow the recommended curing temperature and time schedule. Note that addition-cure silicones can be poisoned by substances containing sulfur, amines, etc. Always conduct small-scale testing on actual substrates before full production.

TENSAN provides customized potting solutions for diverse industries. Whether you require optically clear, thermally conductive, flame-retardant, or highly flexible potting materials, we offer professional technical support and product matching. We recommend testing on actual substrates and following proper processing procedures to achieve reliable results. For selection advice or sample support, please contact the TENSAN technical team.