SMT Red Glue
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SMT Red Glue

Features & Benefits Tensan SMT red glue 4109A is a one-component epoxy adhesive, curing at high temperature. SMT red glue is designed for SMD components on printed circuit board bonding. 4109A has suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing . REACH, ROHS, certified Excellent thixotropy Good adhesive strength after curing Easy to mix and use

Model:TS4109A

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Product Description

Features & Benefits of SMT Red Glue TS4109A

Tensan SMT red glue 4109A is a one-component epoxy adhesive, curing at high temperature.

SMT red glue is designed for SMD components on printed circuit board bonding. 4109A has  suitable for high-speed SMT placement machine Dispensing and stencil printing. It is of high adhesive strength after curing .

◆  REACH, ROHS, certified

◆  Excellent thixotropy

◆  Good adhesive strength after curing

◆  Easy to mix and use


Instructions andPrecautions of SMT Red Glue TS4109A

Cold storage 4109A to be rewarmed before use, 30ml syringe to be 1 hour, 300ml 24 hours. Storage tank or dispensing mouth temperature at 25℃-30℃ can help improve the high-speed dispensing effect.

Precautions:

1.In order to avoid contaminating unused glue, any glue can not be back into the original packaging.

2.Glue placing in the air will absorb trace moisture performance, which will influence the properties of glue, so it should be avoided. In the stencil printing, do not put SMT printed circuit board in the air for too long,  patch curing as soon as possible, if possible, air humidity should be controlled.


Packing Information of SMT Red Glue TS4109A

30ml/syringe

300ml/syringe

Storage andValidity

2-8℃, cool and dry place, it can be stored for 6 months; room temperature (25℃), it can be stored for 1 month.


Typical Properties of SMT Red Glue TS4109A

Item

Index

Specific Gravity

(g/cm3)

1.38

Viscosity at 5rpm 25℃

390.000cps

Adhesive Strength

( 2125c)

38N(3.9kgf)

Adhesive Strength

(Mini-mold tr)

38N(3.9kgf)

Adhesive Strength

(SOP-IC 16P)

92N(9.4kgf)

Thixotropy Index

5.0

Electric Property

(Ω.cm)

1.8*10^1

Resistance Insulation

(Ω.cm)

3.4*10^14

Resistance Initial Value

(Ω.cm)

2.1*10^32

Curing Condition

150℃/60sec

130℃/90sec

 

Applying Method

Screen Printing Thick Mask

Dielectric Constant

3.8 (100KHz)

Dielectric Loss Tangent

0.027 (100KHz)

Preservation Condition

Refrigerated storage at 2-8℃

Package Style

30ml/syringe

200gl/syringe

 

Other Information

The above information are correct, but does not contain all of the information and can only be used as a guide.

This product is ROHS, REACH, compliant. It does not contain any unknow carcinogenic, mutagenic or teratogenic components.

 

For further info please visit our web:

 www.sztensan.com

 

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