SMT Red glue Manufacturers

Thermal adhesive has good thermal conductivity and high-grade pressure resistance, good adhesion, good adhesion to aluminum, copper, stainless steel, polycarbonate (PC) and other materials, excellent dielectric properties, Good heat resistance, general use temperature range -50℃～200℃. Thermal adhesive is an adhesive product with bonding and sealing functions, which has multiple curing methods such as single/two-component, thermally conductive, room temperature curing/heat curing/catalyst-promoted.

Tensan thermal pads have outstanding performance in multiple aspects. In thermal conductivity, advanced technology enables efficient heat transfer, far better than ordinary pads. It has excellent insulation performance, preventing leakage and short circuits, while some ordinary pads have potential risks. It has a wide temperature resistance range and remains stable at high temperatures, while ordinary pads are prone to aging and failure. With good flexibility, it can closely fit heat dissipation surfaces, while ordinary pads may have poor contact. Its compression and rebound performance is excellent, maintaining well after multiple compressions, while ordinary pads have a rapid decrease in rebound rate. Although Tensan thermal pads have obvious advantages, the actual selection still needs to be comprehensively considered according to equipment and working conditions, providing an important reference for material selection in the heat dissipation field.

Electronic potting adhesive can play a waterproof, moisture-proof, dust-proof, insulation, thermal conductivity, sealing, anti-corrosion, temperature resistance, shockproof role after curing.

You may not know, in each major electronic equipment to bring us countless convenience in the warmth of time, a lot of forgotten electronic equipment in a very important product, this is the electronic cooling paste.

Among the heat dissipation materials, thermal grease has a higher use value, which makes the CPU work at normal temperature and greatly prolongs the service life. However, it is not the same as most heat-dissipating materials. It needs to be applied in the correct way to avoid waste of materials and show a better heat-dissipation effect.

The thermally conductive silicone pad fills the air gap between the heat-generating device and the heat sink or metal base. Their flexible and elastic characteristics allow them to be used to cover very uneven surfaces. Heat is conducted from the separation device or the entire PCB to the metal casing or diffusion plate, and the thermally conductive silicone pad can improve the efficiency and service life of the heating electronic component.