Low-Ag Low-Void No-Clean Solder Paste

Low-Ag No-Clean Solder Paste with Excellent Wetting & Low Voiding – TENSAN TS-506

In today's competitive electronics manufacturing environment, cost control is just as critical as product quality. As raw material prices fluctuate, many SMT lines are seeking alternatives to high-silver SAC305 alloys without sacrificing soldering performance or production yield.

TENSAN TS-506 is a low-silver, no-clean solder paste engineered to deliver the perfect balance between cost and performance. With its Sn98.5Ag1.0Cu0.5 alloy composition, TS-506 offers excellent wetting, low voiding, and stable printing—all at a more affordable price point than traditional SAC305 pastes.

What Is TENSAN TS-506?

TENSAN TS-506 is a lead-free, no-clean solder paste designed for SMT assembly processes requiring:

• Lower material cost – Reduced silver content (1.0% vs. 3.0% in SAC305) significantly lowers alloy cost
• Excellent wetting – Advanced flux chemistry ensures strong wetting on various PCB surface finishes
• Low voiding – Specially formulated to minimize gas entrapment in solder joints
• Stable printing – Consistent viscosity and shape retention for fine-pitch applications
• No-clean convenience – Minimal, transparent residue that supports ICT testing without cleaning

Key Specifications

Alloy & Physical Properties                    

Why Choose TENSAN TS-506 Low-Ag Solder Paste?

1. Cost-Effective Alloy Composition

TS-506 uses Sn98.5Ag1.0Cu0.5, a low-silver SAC alloy that:

• Reduces material cost by approximately 30–40% compared to SAC305
• Maintains comparable melting point and soldering performance
• provides excellent mechanical reliability for most consumer and industrial applications

For manufacturers looking to reduce production costs without compromising quality, TENSAN TS-506 is the ideal low-Ag no-clean solder paste.

2. Excellent Wetting Performance

Despite its lower silver content, TS-506 delivers strong wetting and climbing ability on:

• ENIG (Electroless Nickel Immersion Gold)
• OSP (Organic Solderability Preservative)
• HASL (Hot Air Solder Leveling)
• Immersion Silver and Immersion Tin

The advanced flux system ensures rapid and complete wetting, producing bright, well-formed solder fillets with minimal defects.

3. Ultra-Low Voiding for Reliable Joints

Voids in solder joints reduce thermal and mechanical reliability. TENSAN TS-506 is specifically formulated to minimize void formation in:

• QFN packages with large thermal pads
• BGA components
• Power semiconductors

By choosing this low-void no-clean solder paste, you achieve stronger, more reliable solder joints with better thermal conductivity.

4. Exceptional Print Performance for Fine-Pitch Applications

TS-506 delivers stable printing performance across a wide range of conditions:

• Print speeds: 25 – 150 mm/s
• Stencil thickness: 100 – 150 μm
• Fine-pitch pads down to 0.25 mm (10 mil)

Its optimized rheology ensures clean stencil release, sharp edge definition, and minimal slump—reducing bridging and solder insufficiency defects.

5. Long Stencil Life and Stable Viscosity

Production efficiency depends on minimizing downtime. TS-506 maintains:

• Consistent viscosity over extended print runs
• Minimal drying on stencil surfaces
• Reliable transfer efficiency across 8+ hour shifts

This stability makes TENSAN TS-506 a dependable low-silver SAC solder paste for high-volume manufacturing environments.

6. Minimal No-Clean Residue

After reflow, TS-506 leaves approximately 5% (w/w) residue that is:

• Transparent and non-conductive
• ICT probe-testable without cleaning
• Stable under humidity and temperature variations (SIR ≥ 1.0 × 10⁸ Ω)

This eliminates post-reflow cleaning in most applications, reducing chemical costs and process steps.

Storage and Handling Guidelines

Important: Always warm up TS-506 in its sealed container to prevent moisture condensation, which can cause spattering and increased voiding during reflow.

Typical Applications

TENSAN TS-506 is proven across multiple industries where cost and performance are equally important:

• Consumer Electronics – Smartphones, tablets, wearables, laptops, peripherals
• Automotive – ECUs, sensors, lighting modules (non-safety-critical)
• Telecommunications – Base stations, routers, RF modules
• Industrial Controls – PLCs, motor drives, power supplies
• LED Lighting – High-density PCBs with thermal management needs
• Home Appliances – Control boards, display modules

Quality Assurance

Every batch of TENSAN TS-506 is accompanied by a Certificate of Analysis confirming:

• Model and batch numbe
• Alloy composition (Sn98.5Ag1.0Cu0.5)
• Flux content (wt%)
• Viscosity measurement at 25°C

Our manufacturing processes ensure consistent product quality from lot to lot, giving you confidence in every production run.

Frequently Asked Questions

Q: What is the difference between TS-506 and TS-350?

A: TS-506 uses a low-silver alloy (Sn98.5Ag1.0Cu0.5) while TS-350 uses SAC305 (Sn96.5Ag3.0Cu0.5). TS-506 offers lower material cost with slightly reduced thermal fatigue resistance, making it suitable for less demanding applications.

Q: Is TENSAN TS-506 suitable for fine-pitch printing?

A: Yes. This low-Ag no-clean solder paste performs excellently on standard 0.5 mm pitch and ultra-fine 0.25 mm (10 mil) pitch applications.

Q: Does TS-506 support paste-in-hole (PiH) processes?

A: Yes, TS-506 is compatible with paste-in-hole applications.

Q: What is the shelf life of TS-506?

A: Six months from the production date when stored at 2–10°C.

Q: Can TS-506 be used in nitrogen reflow?

A: Yes, TS-506 performs well in both air and nitrogen reflow environments.

Q: Is TS-506 halogen-free?

A: TS-506 is L0 grade (< 500 mg/kg halogens) according to IPC-TM-650 2.3.35, qualifying as halogen-free.

Conclusion

For manufacturers seeking to reduce material costs while maintaining reliable SMT assembly performance, TENSAN TS-506 offers the ideal solution.

This low-Ag no-clean solder paste delivers:

• Significant material cost savings without major performance trade-offs
• Excellent wetting and low voiding for reliable solder joints
• Stable printing and long stencil life for high productivity
• Minimal residue and no-clean convenience

By choosing TENSAN TS-506, you achieve cost-effective production without compromising quality.

Contact Information

TENSAN VIETNAM CO., LTD

TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam

Tel: +84-222-650-8818

Email: mark@sztensan.com