TS-350 is a lead-free no-clean high-performance solder paste compatible with all types of SMT printers, suitable for general assembly and ultra-fine pitch processes down to 0.28mm, and supports PiH paste-in-hole technology for complex components like BGA and QFN. It features stable printability, superior wetting, low void rate and excellent HiP resistance with a wide reflow window for air and nitrogen reflow environments. Low transparent non-conductive residues allow direct ICT testing without cleaning. RoHS-compliant with consistent lot-to-lot performance, it serves consumer, automotive, industrial, medical and telecom electronics, boosting first-pass yield and cutting rework & downtime costs.
In modern SMT assembly, the solder paste printer is the gateway to quality—every defect that escapes the printing stage cascades through reflow and testing. That's why TS-350 is engineered not just as a high-performance solder paste, but as a formulation that works in harmony with your solder paste printer to deliver consistent, repeatable results from the first board to the last.
In the fast-paced world of electronics manufacturing, every production line faces the same critical challenges: achieving consistent print quality, minimizing defects, and maintaining high first-pass yields. As component geometries shrink and PCB designs grow more complex, the solder paste you choose—and how well it performs on your solder paste printer —directly determines your production efficiency and product reliability.
High-performance solder paste featuring outstanding printability and superior wetting performance is precisely what TS-350 delivers—a lead-free, no-clean solder paste engineered specifically for manufacturers demanding ultra-fine pitch capability without compromising on soldering quality. Its formulation is tailored to respond predictably to the squeegee pressure, print speed, and separation parameters of any modern solder paste printer, minimizing process variables and maximizing deposition accuracy.
Whether you're running high-volume production or specialized rework operations, TS-350 provides the stability, consistency, and wetting characteristics that today's SMT assembly lines require. When paired with a well-maintained solder paste printer, TS-350 transforms the printing station into a reliable, high-yield process node—reducing the need for downstream touch-ups and rework.
What Makes TS-350 a High-performance solder paste featuring outstanding printability and superior wetting performance?
TS-350 is a widely adopted no-clean solder paste formulated to bridge the gap between tin-lead and lead-free processes. Its balanced chemistry ensures stable printing over extended production runs while delivering the wetting performance needed for reliable solder joints. The paste's rheology is specifically designed to work with the shear and recovery dynamics of your solder paste printer, enabling clean aperture release and sharp deposit definition even at high cycle rates.
High-performance solder paste featuring outstanding printability and superior wetting performance like TS-350 combines advanced rheology with robust flux activation, making it suitable for both standard SMT assembly and demanding applications such as QFN, BGA, and ultra-fine pitch components down to 11 mil (0.28mm) square pads. To achieve the best results on ultra-fine features, we recommend verifying that your solder paste printer's alignment system and stencil clamping mechanism are properly calibrated—ensuring that the paste's superior printability is fully translated to the PCB.
Alloy Composition
Physical & Electrical Properties
Core Features and Benefits
1. Outstanding Print Performance
TS-350 delivers High-performance solder paste featuring outstanding printability and superior wetting performance consistently across long production runs, with characteristics that are specifically matched to the operating envelope of today's solder paste printer systems.
2. Superior Wetting and Soldering Quality
Wetting performance directly affects joint reliability. TS-350's flux chemistry ensures rapid and complete wetting on various surface finishes.
3. Minimal Residue and Clean Solder Joints
4. Excellent Head-in-Pillow (HiP) Resistance
QFN and BGA assemblies are susceptible to head-in-pillow defects. TS-350 is specifically formulated to resist this failure mode, improving first-pass yields on in-line testing.
5. RoHS Compliance
Fully compliant with RoHS Directive 2002/95/EC, ensuring regulatory compliance for electronics exports to global markets.
Handling Procedure
Important: Always warm up sealed containers to prevent condensation on the paste surface. Condensation can introduce moisture, leading to spattering and void formation during reflow.
Recommended temperature
Safety Considerations
Quality Assurance
Each batch of TS-350 is accompanied by a Certificate of Analysis covering:
Our quality system ensures consistent product performance from lot to lot, giving you confidence in your production process. For process optimization, we recommend periodically verifying that your solder paste printer's pressure, speed, and separation settings are aligned with the paste's viscosity profile—this simple cross-check can significantly reduce print variability across batches.
Typical Applications
TS-350 is designed for:
Frequently Asked Questions
Q: Can TS-350 be used for both standard and fine-pitch printing?
A: Yes. High-performance solder paste featuring outstanding printability and superior wetting performance is formulated to perform equally well on standard 0.5 mm pitch and ultra-fine 0.25 mm (10 mil) pitch applications. To maximize fine-pitch performance, ensure your solder paste printer is equipped with a vision alignment system capable of ±25 μm accuracy and closed-loop squeegee pressure control.
Q: What is the recommended stencil for TS-350?
A: ALPHA® Stencils or equivalent high-quality laser-cut stainless steel stencils are recommended for optimal release and shape retention.
Q: Does TS-350 support paste-in-hole (PiH) applications?
A: Yes, TS-350 is suitable for paste-in-hole processes.
Q: How long can TS-350 sit on the stencil during production?
A: With its stable viscosity and excellent stencil life, TS-350 maintains print performance throughout typical production shifts. For shifts exceeding 8 hours, we recommend programming your solder paste printer to perform a brief stencil wipe cycle every 30–45 minutes to maintain consistent aperture release. Always reseal unused paste to maximize its usable life.
Conclusion
Choosing the right solder paste is one of the most critical decisions in SMT assembly. TS-350 delivers everything you need: consistent printing, superior wetting, minimal residue, and proven reliability across a wide range of applications. But to unlock its full potential, your solder paste printer must be properly configured, calibrated, and maintained—because the printing station is where quality is either won or lost.
High-performance solder paste featuring outstanding printability and superior wetting performance like TS-350 helps you achieve:
For manufacturers seeking a stable, high-quality lead-free solder paste that bridges the gap between tin-lead legacy processes and today's demanding lead-free requirements, TS-350 is the proven choice. Our application team is available to assist with solder paste printer parameter setup, stencil design recommendations, and on-site process audits to help you achieve optimal results with TS-350.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84-222-650-8818
Email: mark@sztensan.com
For inquiries regarding alternative alloys, custom packaging, or 【solder paste printer compatibility and process parameter optimization】, please contact your local Tensan sales office.
