TENSAN TS‑503 is a lead‑free, no‑clean solder paste designed for medium‑temperature reflow processes.
Automatic Solder Paste Mixer – TENSAN TS-503 No-Clean Solder PasteIn SMT assembly, the solder paste mixer plays a pivotal role in ensuring consistent print quality and reliable soldering performance. After cold storage, the components of solder paste can separate due to density differences and prolonged storage. An Automatic Solder Paste Mixer restores homogeneity, ensuring the flux is evenly distributed and the powder particles are uniformly suspended. Without proper mixing, even the best solder paste can exhibit inconsistent viscosity, poor transfer efficiency, and increased defects. TENSAN TS‑503 is a No-Clean Solder Paste specifically engineered to respond optimally to any solder paste mixer – whether manual or automatic – delivering fast homogenisation, stable rheology, and consistent performance across every print.What Is TENSAN TS-503 for Automatic Solder Paste Mixer?TENSAN TS‑503 is a lead‑free, no‑clean solder paste designed for medium‑temperature reflow processes. This advanced solder paste is formulated with a Sn‑Ag0.3‑Bi35 alloy and features:Fast homogenisation – Restores uniform consistency in just 1–3 minutes when processed through an Automatic Solder Paste MixerLower reflow temperature – Bismuth content (34.5–35.5%) reduces melting point, protecting heat‑sensitive componentsExcellent printability – Type 4 powder (20–38 μm) ensures consistent deposit volume for fine‑pitch applicationsNo‑clean convenience – Minimal, clear residue that supports ICT testing without cleaningLong stencil life – Stable rheology maintains print performance for >8 hours after mixingHigh reliability – Passes SIR and electromigration tests for long‑term electrical stabilityWhether you use an Automatic Solder Paste Mixer or manual mixing methods, TS‑503 delivers uniform flux‑to‑powder distribution, ensuring every print has the same high quality and consistency.
Key Specifications
Alloy Composition & Physical Properties
Chemical & Electrical Properties
Physical Properties
Why Choose TENSAN TS-503 with Your Automatic Solder Paste Mixer?1. Fast and Effective HomogenisationAfter prolonged cold storage (5–10°C), solder paste components can separate slightly – flux may rise to the top, and powder may settle. TS‑503 is formulated to re‑homogenise quickly and uniformly when processed through an Automatic Solder Paste Mixer. With just 1–3 minutes in a planetary or centrifugal solder paste mixer, the paste returns to its optimal consistency, ensuring that every print has the same flux‑to‑powder ratio. This rapid response to mixing reduces preparation time and maximises your Automatic Solder Paste Mixer throughput – a key advantage for high‑volume production lines.2. Stable Viscosity After MixingOnce mixed, TS‑503 maintains its viscosity within specification for more than 8 hours on the stencil. This stability means that you can prepare paste in your solder paste mixer at the start of a shift and rely on consistent performance throughout the day – without viscosity drift or slump. This consistency is essential for maintaining high first‑pass yields on fine‑pitch assemblies.3. Excellent Printability – Preserved After MixingThe rheology of TS‑503 is optimised for automated printing: it shear‑thins under squeegee pressure for easy aperture filling, then quickly recovers to hold its shape after release. This behaviour is fully preserved after mixing in any Automatic Solder Paste Mixer, delivering sharp deposits with minimal slump – even on ultra‑fine 0.25 mm pitch pads. Proper mixing in a solder paste mixer ensures that the thixotropic properties of the paste are fully restored, giving you consistent print volumes throughout the production run.4. No‑Clean, Low‑Residue – Saves Process StepsThe flux system leaves a clear, non‑conductive residue that supports ICT testing without post‑reflow cleaning. The consistency of this residue is ensured by proper mixing in your solder paste mixer, which guarantees uniform flux distribution. This eliminates cleaning steps, reduces chemical costs, and simplifies the overall process – a significant advantage when running high‑volume production.5. Lower Reflow Temperature – Protects ComponentsThe Sn‑Ag0.3‑Bi35 alloy reduces the peak reflow temperature to 210–230°C, significantly lower than SAC305. This protects heat‑sensitive components – such as LEDs, plastic connectors, and flexible substrates – while still forming strong, reliable joints. And because the paste homogenises perfectly in your Automatic Solder Paste Mixer, you get consistent alloy distribution and uniform melting behaviour across every joint.6. Cost‑Effective Formulation – Low Silver ContentWith silver content reduced to 0.3–0.5%, TS‑503 offers significant material cost savings compared to higher‑silver pastes. This makes it an attractive solder paste choice for high‑volume production, especially when processed through an efficient solder paste mixer that minimises waste and ensures consistent quality.
Recommended Mixing and Application Parameters
Stencil Design Guidelines
Stencil Technologies: Electroformed and laser‑cut stencils with electro‑polishing provide optimal printing characteristics. "Roof‑shaped" aperture designs help reduce solder balling between components.
Printing Conditions
Reflow Profile (Recommended)
The lower peak temperature of this No-Clean Solder Paste provides a protective thermal environment for heat‑sensitive components while still delivering strong, reliable solder joints. Adjust profiles based on your specific reflow oven and PCB assembly requirements.
Storage, Handling, and Mixing Guidelines with Your Solder Paste Mixer
Important: Always warm up this solder paste in its sealed container to prevent moisture condensation, which can cause spattering during reflow. After warming, process the paste in your Automatic Solder Paste Mixer according to the recommended time. Do not mix leftover paste with fresh paste in the same container. Proper mixing in a solder paste mixer is essential to restore the paste’s original performance characteristics after cold storage.
Alloy Composition Overview
Typical Applications for This Solder Paste Mixer-Compatible Product
TS‑503 is ideal for applications requiring medium‑temperature reflow and consistent mixing:
In every application, proper use of an Automatic Solder Paste Mixer with TS‑503 ensures consistent paste properties and reliable soldering.
Quality Assurance
Every batch of TENSAN TS‑503 is accompanied by a Certificate of Analysis confirming:
Our rigorous quality control ensures consistent solder paste quality from lot to lot – and that the paste responds predictably to your solder paste mixer operations.
Frequently Asked Questions
Q: Why is mixing important for TS-503 solder paste?
A: Cold storage can cause separation of flux and powder. Using a solder paste mixer restores homogeneity, ensuring consistent flux distribution, stable viscosity, and repeatable printing performance. TS‑503 is specifically designed to respond quickly and uniformly to any Automatic Solder Paste Mixer.
Q: What type of solder paste mixer is recommended for TS-503?
A: A planetary or centrifugal Automatic Solder Paste Mixer is ideal, with 1–3 minutes of mixing time. Manual mixing (3–6 minutes) is also acceptable. Always follow the manufacturer's instructions for your specific solder paste mixer.
Q: How long can TS-503 stay on the stencil after mixing?
A: Over 8 hours under normal conditions (22–28°C, 30–60% RH), provided the paste was properly homogenised in your Automatic Solder Paste Mixer before use.
Q: Can I use TS-503 directly from the refrigerator without a solder paste mixer?
A: No. After cold storage, you must warm up the paste (4 hours sealed at room temperature) and then mix it thoroughly using a solder paste mixer or manually. Without proper mixing, flux separation can cause inconsistent printing and soldering defects.
Q: What is the shelf life of TS-503?
A: Six months from production date when stored at 5–10°C.
Q: Does TS-503 require special handling after mixing?
A: Keep the paste sealed when not in use. If printing is interrupted, cover the stencil to prevent drying. Always reseal the jar immediately after dispensing paste for your next batch.
Conclusion
For manufacturers who rely on consistent, high‑quality SMT assembly, the combination of a reliable Automatic Solder Paste Mixer and a compatible solder paste is essential. TENSAN TS‑503 is formulated to perform perfectly with any solder paste mixer – delivering fast homogenisation, stable viscosity, excellent printability, and reliable soldering at lower reflow temperatures. By integrating TS‑503 into your process, you reduce defects, protect heat‑sensitive components, and maximise the efficiency of your Automatic Solder Paste Mixer and printing equipment.
Choose TENSAN TS‑503 – the No-Clean Solder Paste that makes every Automatic Solder Paste Mixer work better.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
