TS505 is a lead‑free, high‑temperature solder paste based on the Sn99Ag0.3Cu0.7 (SAC0307) alloy (melting point 217–218°C), formulated for high‑reliability SMT assembly. Its advanced rheology ensures seamless compatibility with any solder paste printer – manual, semi‑automatic, or fully automated – delivering consistent transfer, excellent shape retention on fine‑pitch pads (down to 0.4 mm), and extended stencil life with reduced cleaning stops.
In the demanding world of electronics manufacturing, production efficiency hinges on the seamless interaction between materials and equipment. The solder paste printer is the gateway to your entire SMT line—its ability to deposit consistent, well-defined paste volumes directly determines your defect rates and first-pass yields. However, even the best solder paste printer can only perform as well as the paste running through it. That’s where TS505 comes in—a high-temperature, lead-free solder paste engineered specifically to maximize the capabilities of any solder paste printer, whether you're running fine-pitch consumer boards or large-format telecom backplanes.
Why TS505 Is the Ideal Match for Your Solder Paste Printer?
TS505 is a lead-free solder paste based on the Sn99Ag0.3Cu0.7 (SAC0307) alloy system, with a melting range of 221°C to 227°C. It belongs to the high-temperature lead-free series and is formulated for high-reliability electronic assembly. What makes it particularly noteworthy is how effortlessly it interacts with your solder paste printer—delivering stable rollability, consistent transfer efficiency, and minimal aperture clogging even during extended production runs.
Whether you're using a manual solder paste printer for prototyping or a fully automated inline solder paste printer for high-volume production, TS505 adapts to the mechanical demands of the process, ensuring that every deposit matches the stencil geometry with high fidelity.
Product Specifications
Alloy Composition
Solder Paste Specification
Alloy Physical Properties
Reflow Profile
Core Advantages – Engineered for the Solder Paste Printer
1. Outstanding Printability for the Solder Paste Printer
TS505's rheology is specifically designed to work harmoniously with your solder paste printer. The paste exhibits excellent rollability and thixotropic recovery, ensuring that every stroke of the squeegee delivers a uniform, well-defined deposit.
This compatibility means that whether you're using a high-speed solder paste printer for consumer electronics or a precision solder paste printer for automotive modules, TS505 delivers consistent, repeatable results.
2. Excellent Wettability and Solder Wicking
Thanks to its optimally activated flux system, TS505 demonstrates superior wetting and solder wicking performance during the reflow stage. It forms full, bright solder joints even on OSP-coated or mildly oxidized pads—ensuring that the consistent deposits from your solder paste printer translate into reliable electrical and mechanical connections.
3. Low Voiding
The refined flux formulation effectively minimizes void formation during reflow—particularly critical for large thermal-mass components (e.g., QFN, LGA, thermal pads)—significantly enhancing solder joint reliability. Low voiding begins with consistent deposit volumes, which your solder paste printer delivers reliably.
Typical Applications
TS505 is designed for high-reliability assemblies where solder paste printer consistency and joint quality are paramount:
Frequently Asked Questions
Q: Is TS505 compatible with any solder paste printer?
A: Yes. TS505 is formulated to deliver excellent printing performance on all standard solder paste printers, whether manual, semi-automatic, or fully automated. Its rheology ensures stable rollability and consistent transfer.
Q: What stencil type works best with this solder paste printer application?
A: Laser-cut stainless steel stencils with electro-polished apertures are recommended for optimal release and shape retention when running TS505 on your solder paste printer.
Q: Can TS505 be used for paste-in-hole (PiH) processes?
A: Yes, TS505 is suitable for paste-in-hole applications, provided the solder paste printer is set up with appropriate parameters for volume and placement.
Q: How long can TS505 sit on the stencil during production?
A: Under standard shop-floor conditions (20–25°C, RH < 65%), TS505 maintains its print performance throughout typical production shifts, reducing cleaning frequency for your solder paste printer.
Package & Shipping
Each bottle contains 500g of TS505, packed in wide-mouth plastic (PE) bottles with an inner seal. Bottles are shipped in foam-lined boxes, with a maximum of 20 bottles per box, maintaining internal temperatures below 35°C during transit.
Quality Assurance
Each batch of TS505 undergoes rigorous quality control testing to ensure consistent performance. Key parameters verified include:Alloy composition (by ICP or XRF)Powder size distributionFlux content and activityViscosity at 25°CHalogen content (L1 level compliance)Our quality system ensures that every batch delivers the same reliable performance on your solder paste printer—batch after batch.
Conclusion
The relationship between your solder paste printer and the paste you run through it is symbiotic—one cannot succeed without the other. TS505 is engineered to maximize the capabilities of your solder paste printer, delivering:
For manufacturers who demand both productivity and quality, TS505 is the ideal partner for your solder paste printer—whether you're assembling telecom infrastructure, automotive modules, or the latest consumer devices.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
For inquiries regarding alternative alloys, custom powder sizes, or packaging options, please contact your local Tensan sales representative.
