TENSAN TS‑501 is a lead‑free, Bi‑containing alloy paste that lowers reflow temperatures while maintaining excellent printability and joint reliability. It is the ideal solder paste for automated printing environments where stability, cleanliness, and process flexibility are paramount. With Type‑4 powder, ROL1 flux, and long stencil life, this Automatic Solder Paste Printer solution ensures that every print – from the first to the thousandth – meets the highest quality standards.
In modern SMT assembly, the performance of your solder paste printer directly impacts yield, throughput, and overall cost of ownership. When paired with a high‑performance Automatic Solder Paste Printer, the paste itself must deliver consistent rheology, fine‑pitch accuracy, and extended stencil life to keep production running smoothly. TENSAN TS‑501 is precisely such a material – a mid‑temperature, no‑clean solder paste formulated to excel on any Automatic Solder Paste Printer, whether you run high‑volume consumer lines or specialised heat‑sensitive assemblies.
Automatic Solder Paste Printer – TENSAN TS‑501 is a lead‑free, Bi‑containing alloy paste that lowers reflow temperatures while maintaining excellent printability and joint reliability. It is the ideal solder paste for automated printing environments where stability, cleanliness, and process flexibility are paramount. With Type‑4 powder, ROL1 flux, and long stencil life, this Automatic Solder Paste Printer solution ensures that every print – from the first to the thousandth – meets the highest quality standards.
What Is TENSAN TS‑501 for Automatic Solder Paste Printer?
TS‑501 is a no‑clean, mid‑temperature solder paste designed for SMT processes that demand:
Key Specifications
Alloy Composition & Physical Properties
Chemical & Electrical Properties
Physical Properties
Test methods conform to IPC J‑STD‑004, IPC J‑STD‑005, JIS Z 3284, and Bellcore GR78‑CORE standards.
Why Choose TENSAN TS‑501 for Your Automatic Solder Paste Printer?
1. Optimised Rheology for Automated Printing
TS‑501 is engineered with a shear‑thinning behaviour that responds perfectly to the squeegee action of an Automatic Solder Paste Printer. It flows easily through fine apertures, then rapidly recovers viscosity to hold its shape – ensuring sharp, slump‑free deposits. Whether your solder paste printer operates at 25 mm/s or 100 mm/s, TS‑501 delivers consistent transfer efficiency across the entire panel.
2. Long Stencil Life – Maximises Printer Uptime
The flux system resists drying at room temperature, maintaining stable viscosity for more than 8 hours on the stencil. This means fewer cleaning interruptions and less paste waste – critical for any high‑volume Automatic Solder Paste Printer line. Operators can run full shifts without viscosity drift, directly improving OEE.
3. Fine‑Pitch Capability Down to 0.25 mm
With Type‑4 powder (20–38 μm) and a carefully balanced flux, TS‑501 supports ultra‑fine pitch printing, making it an ideal solder paste for compact designs. Your solder paste printer can reliably print 0.25 mm (10 mil) pads without bridging or insufficient deposit, thanks to the paste’s excellent release characteristics.
4. No‑Clean, Low‑Residue – Saves Cleaning Steps
After reflow, TS‑501 leaves a clear, dry residue that is non‑conductive and fully compatible with ICT. This eliminates the need for post‑print cleaning, reducing chemical costs and cycle time – a major benefit when operating a high‑speed Automatic Solder Paste Printer in a lean manufacturing environment.
5. Broad Process Window – Adapts to Your Printer Settings
TS‑501 is forgiving across a wide range of printing parameters: pressure (0.020–0.027 kg/mm blade length), speed (25–100 mm/s), and ambient conditions (22–28°C, 30–60% RH). This flexibility ensures that even if your solder paste printer has slight variations, the paste maintains consistent output, reducing scrap and rework.
6. Reliable Electrical Performance – Even Under Humidity
With SIR exceeding 1.7×10⁹ Ω (IPC) and passing Bellcore electromigration tests, TS‑501 ensures that the residue left by the Automatic Solder Paste Printer does not compromise long‑term reliability – essential for automotive and telecommunications applications.
Recommended Application Parameters for Your Solder Paste Printer
Stencil Design Guidelines
Stencil Technologies: Electroformed and laser‑cut stencils with electro‑polishing work best. “Roof‑shaped” apertures reduce solder balling.
Printing Conditions for Automatic Solder Paste Printer
These settings are tailored for any modern solder paste printer, ensuring that TS‑501 performs optimally whether you use a fully automatic or semi‑automatic machine.
Reflow Profile (Recommended)
The lower peak temperature protects heat‑sensitive components while still forming strong joints. Adjust based on your specific oven and board design.
Storage and Handling Guidelines for This Automatic Solder Paste Printer Grade
Important: Do not mix leftover paste with fresh paste. Always warm up in sealed container to prevent moisture condensation, which can cause spattering – especially critical when running a high‑speed Automatic Solder Paste Printer.
Alloy Composition Overview
Typical Applications for This Automatic Solder Paste Printer Solution
TS‑501 is used in industries where lower reflow temperatures and automated printing are essential:
In every application, this Automatic Solder Paste Printer grade ensures consistent printing and reliable soldering.
Quality Assurance
Every batch of TENSAN TS‑501 is accompanied by a Certificate of Analysis confirming:
Our stringent QC ensures that each shipment delivers the same high printability, making it a dependable choice for your solder paste printer operations.
Frequently Asked Questions
Q: Is TS‑501 compatible with all automatic solder paste printers?
A: Yes. TS‑501 is formulated to work seamlessly with any Automatic Solder Paste Printer from leading brands, as well as semi‑automatic printers. Its rheology is optimised for a wide range of squeegee pressures and speeds.
Q: What makes this paste suitable for a solder paste printer?
A: Its stable viscosity, Type‑4 powder, and low slump ensure consistent deposit volumes over long runs – exactly what a high‑speed solder paste printer requires. This is why we call it an Automatic Solder Paste Printer solution.
Q: Can I use TS‑501 on a fine‑pitch (0.4 mm) BGA with my printer?
A: Absolutely. The Type‑4 powder and sharp release characteristics make it ideal for fine‑pitch printing on any capable solder paste printer.
Q: How long can the paste stay on the stencil of my automatic printer?
A: Over 8 hours under normal conditions (22°C, 50% RH), reducing the need for frequent cleaning – a key advantage for any Automatic Solder Paste Printer line.
Q: Does TS‑501 require special under‑stencil cleaning?
A: Standard cleaning solvents like isopropyl alcohol (IPA) work well. Follow your solder paste printer manufacturer’s recommendations for stencil cleaning frequency.
Q: Is this paste RoHS compliant?
A: Yes, it is fully lead‑free and RoHS compliant.
Conclusion
For manufacturers running high‑volume SMT lines with heat‑sensitive components, choosing the right material for your Automatic Solder Paste Printer is critical. TENSAN TS‑501 is that material – a mid‑temperature, no‑clean solder paste that delivers exceptional print stability, fine‑pitch accuracy, long stencil life, and excellent electrical reliability. By integrating TS‑501 into your solder paste printer workflow, you reduce defects, lower reflow temperatures, and achieve cleaner boards without compromising productivity.
This Automatic Solder Paste Printer solution is trusted by leading EMS providers for its consistency and robust performance. Whether you are printing LEDs, flexible circuits, or complex automotive modules, TS‑501 ensures that your solder paste printer runs at peak efficiency.
Choose TENSAN TS‑501 – the solder paste that makes your automatic printer shine.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
