TS-350 is a Type 4 lead-free, no-clean solder paste based on SAC305 alloy (Sn96.5Ag3Cu0.5), with Type 4 powder size (20–38 μm) , melting point of 221–227°C, flux content of 10.5±0.5%, viscosity of 220,000 mPa·s, and halogen content meeting L0 level. Key Advantages: Type 4 powder size (20–38 μm) delivers the ideal balance between fine-pitch capability and process robustness—superior aperture release and higher resolution vs. Type 3, while less prone to oxidation, solder balling, and stencil clogging vs. Type 5. Stable printing, excellent shape retention, strong wetting, low voiding, minimal residue (~5%), supports ultra-fine pitch down to 0.28mm, effective HiP resistance, and fully RoHS compliant. Storage: Refrigerate at 2–10°C (do not freeze), 6-month shelf life. Allow 4+ hours of sealed warm-up before use, followed by 1–2 minutes of mixing. Applications: Consumer electronics, automotive electronics, industrial controls, telecommunications, medical devices, LED lighting (especially fine-pitch/high-density PCB assemblies). TENSAN VIETNAM CO., LTD ｜ +84-222-650-8818 ｜ mark@sztensan.com
The Type 4 Advantage
In modern SMT assembly, powder particle size is one of the most critical factors determining print quality and process stability. As a solder paste type 4 product, TS-350 features a tightly controlled powder distribution of 20–38 μm, delivering the ideal balance between fine-pitch capability and resistance to printing defects such as slumping, clogging, and solder balling.
In the fast-paced world of electronics manufacturing, every production line faces the same critical challenges: achieving consistent print quality, minimizing defects, and maintaining high first-pass yields. As component geometries shrink and PCB designs grow more complex, the solder paste type 4 formulation you choose directly determines your production efficiency and product reliability.
High-performance solder paste featuring outstanding printability and superior wetting performance is precisely what TS-350 delivers—a lead-free, no-clean solder paste engineered specifically for manufacturers demanding ultra-fine pitch capability without compromising on soldering quality. With its Type 4 powder classification (20–38 μm), TS-350 ensures excellent aperture release on fine-pitch stencils while maintaining sufficient solder volume for reliable joint formation.
Whether you're running high-volume production or specialized rework operations, TS-350 provides the stability, consistency, and wetting characteristics that today's SMT assembly lines require. This solder paste type 4 formulation minimizes the risk of aperture clogging and inconsistent deposit heights, ensuring robust printing performance even under demanding conditions.
What Makes TS-350 a High-performance solder paste featuring outstanding printability and superior wetting performance?
TS-350 is a widely adopted no-clean solder paste formulated to bridge the gap between tin-lead and lead-free processes. As a solder paste type 4 solution, its carefully controlled particle size distribution (20–38 μm) enables stable printing over extended production runs while delivering the wetting performance needed for reliable solder joints—even on ultra-fine pitch features down to 11 mil (0.28mm).
High-performance solder paste featuring outstanding printability and superior wetting performance like TS-350 combines advanced rheology with robust flux activation, making it suitable for both standard SMT assembly and demanding applications such as QFN, BGA, and ultra-fine pitch components down to 11 mil (0.28mm) square pads. The Type 4 powder classification ensures that TS-350 contains a high percentage of particles within the optimal 20–38 μm range, delivering consistent paste flow, excellent transfer efficiency, and minimal variation from the first print to the last.
Product Specifications
Alloy Composition
Physical & Electrical Properties
Core Features and Benefits
1. Outstanding Print Performance
TS-350 delivers High-performance solder paste featuring outstanding printability and superior wetting performance consistently across long production runs, as a solder paste type 4 formulation that maintains its rheological stability even under demanding production conditions.
2. Superior Wetting and Soldering Quality
Wetting performance directly affects joint reliability. TS-350's flux chemistry ensures rapid and complete wetting on various surface finishes.
3. Minimal Residue and Clean Solder Joints
Low residue content – approximately 5% (w/w) after solderingClear, easily probe-testable residues suitable for ICT (In-Circuit Test)Non-conductive residues that do not compromise surface insulation resistance
4. Excellent Head-in-Pillow (HiP)
ResistanceQFN and BGA assemblies are susceptible to head-in-pillow defects. TS-350 is specifically formulated to resist this failure mode, improving first-pass yields on in-line testing.
5. RoHS Compliance
Fully compliant with RoHS Directive 2002/95/EC, ensuring regulatory compliance for electronics exports to global markets.
Storage and Handling Guidelines
Storage Conditions
Handling Procedure
Recommended temperature
Frequently Asked Questions
Q: Can TS-350 be used for both standard and fine-pitch printing?
A: Yes. High-performance solder paste featuring outstanding printability and superior wetting performance is formulated to perform equally well on standard 0.5 mm pitch and ultra-fine 0.25 mm (10 mil) pitch applications. As a solder paste type 4 product, TS-350 excels in fine-pitch printing where the 20–38 μm powder size ensures clean aperture release and consistent deposit geometry.
Q: What is the recommended stencil for TS-350?
A: ALPHA® Stencils or equivalent high-quality laser-cut stainless steel stencils are recommended for optimal release and shape retention. For Type 4 solder paste like TS-350, we recommend stencil apertures with an aspect ratio (width/thickness) of at least 1.5 and an area ratio of 0.66 or higher to ensure consistent transfer efficiency.
Q: Does TS-350 support paste-in-hole (PiH) applications?
A: Yes, TS-350 is suitable for paste-in-hole processes.
Q: How long can TS-350 sit on the stencil during production?
A: With its stable viscosity and excellent stencil life, TS-350 maintains print performance throughout typical production shifts. Always reseal unused paste to maximize its usable life.
Q: Why choose a solder paste type 4 product like TS-350 over Type 3 or Type 5?
A: Type 4 (20–38 μm) offers the ideal balance between fine-pitch capability and process robustness. Compared to Type 3, TS-350 provides superior aperture release and finer resolution for miniaturized components. Compared to Type 5, it is less prone to oxidation, solder balling, and stencil clogging, while offering a more forgiving process window. This makes TS-350 the preferred solder paste type 4 choice for manufacturers seeking consistent, high-yield production across a mix of standard and fine-pitch assemblies.
Conclusion
Choosing the right solder paste is one of the most critical decisions in SMT assembly. For manufacturers printing fine-pitch components, selecting a high-performance solder paste type 4 product is essential for achieving consistent deposit quality and reliable solder joints. TS-350 delivers everything you need: consistent printing, superior wetting, minimal residue, and proven reliability across a wide range of applications. As a solder paste type 4 solution, it combines the precision required for ultra-fine features with the robustness needed for high-volume production.
High-performance solder paste featuring outstanding printability and superior wetting performance like TS-350 helps you achieve:
For manufacturers seeking a stable, high-quality solder paste type 4 solution that delivers both fine-pitch precision and production reliability, TS-350 is the proven choice. Our technical team is available to provide stencil design recommendations, printing parameter optimization, and application support to ensure that your move to Type 4 solder paste is seamless and successful.Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84-222-650-8818
Email: mark@sztensan.com
For inquiries regarding alternative alloys, custom packaging, or solder paste type 4 printing parameter optimization and stencil design support, please contact your local Tensan sales office.
