TENSAN TS‑503 is a Fine-Pitch Solder Paste engineered specifically to meet these challenges. With its Type‑4 powder, optimised rheology, and unique Sn‑Ag0.3‑Bi35 alloy, this Solder paste type 4 product delivers exceptional print stability, clean stencil release, and reliable joint formation – making it the preferred Fine-Pitch Solder Paste for LED modules, smartphones, wearables, and other high‑density assemblies.
Fine-Pitch Solder Paste – TENSAN TS-503 Type 4 Solution
In the era of miniaturisation and high‑density electronics, Fine-Pitch Solder Paste has become an essential requirement for modern SMT assembly. As component pitches shrink to 0.4 mm, 0.3 mm, and even 0.25 mm, the demands on solder paste performance have intensified dramatically. The choice of Solder paste type 4 (20–38 μm) is critical for achieving consistent transfer efficiency, sharp edge definition, and minimal defects in fine‑pitch applications. TENSAN TS‑503 is a Fine-Pitch Solder Paste engineered specifically to meet these challenges. With its Type‑4 powder, optimised rheology, and unique Sn‑Ag0.3‑Bi35 alloy, this Solder paste type 4 product delivers exceptional print stability, clean stencil release, and reliable joint formation – making it the preferred Fine-Pitch Solder Paste for LED modules, smartphones, wearables, and other high‑density assemblies.
What Is TENSAN TS-503 Fine-Pitch Solder Paste?
TENSAN TS‑503 is a lead‑free, no‑clean Fine-Pitch Solder Paste designed for SMT assembly processes that demand high‑resolution printing and consistent deposit volumes. This advanced Solder paste type 4 formulation is composed of:
As a Fine-Pitch Solder Paste, TS‑503 is trusted by manufacturers who demand precise, repeatable printing on fine‑pitch QFPs, BGAs, and other high‑density components. This Solder paste type 4 product delivers the performance and reliability required for today's most demanding SMT applications.
Key Specifications
Alloy Composition & Physical Properties
Chemical & Electrical Properties
Physical Properties
Why Choose TENSAN TS-503 as Your Fine-Pitch Solder Paste?
1. Type 4 Powder – Optimised for Fine‑Pitch Printing
The Solder paste type 4 classification (20–38 μm) is specifically chosen to balance fine‑aperture filling with slump resistance. In a Fine-Pitch Solder Paste, the particle size distribution ensures that at least 90% of particles are within this range, enabling reliable printing on apertures as small as 0.20 mm (8 mil) and pitches down to 0.25 mm (10 mil). This makes TS‑503 an ideal Solder paste type 4 product for high‑density boards with 0.4 mm pitch QFPs, BGAs, and ultra‑fine components. The paste releases cleanly from the stencil walls, reducing smearing and ensuring consistent deposit volumes across the entire panel – a hallmark of a true Fine-Pitch Solder Paste.
2. Low‑Silver, Medium‑Temperature Alloy – Protects Components
Unlike standard SAC305 pastes, this Fine-Pitch Solder Paste uses a Sn‑Ag0.3‑Bi35 alloy that lowers the peak reflow temperature to 210–230°C. This protects LEDs, plastic connectors, flexible substrates, and other thermal‑sensitive parts from degradation, while the Solder paste type 4 powder ensures rapid melting and uniform wetting. The combination of Type‑4 powder and Bi35 alloy makes TS‑503 a unique Fine-Pitch Solder Paste that addresses both printability and thermal constraints.
3. Excellent Transfer Efficiency – Consistent Deposit Volumes
The rheology of this Fine-Pitch Solder Paste is engineered to maintain consistent viscosity for over 8 hours on the stencil under normal shop‑floor conditions (22–28°C, 30–60% RH). The Solder paste type 4 particle size ensures excellent release from fine apertures, providing:
This reduces cleaning frequency, minimises paste waste, and ensures that the first print and the thousandth print have identical deposit geometry – a critical factor for high‑volume production using Fine-Pitch Solder Paste.
4. No‑Clean, Low‑Residue – Saves Process Steps
The flux system leaves a clear, non‑conductive residue that does not interfere with ICT or functional testing. This eliminates post‑reflow cleaning, reducing chemical costs and cycle time – a significant advantage when running fine‑pitch boards where cleaning under low‑standoff components can be problematic. This Fine-Pitch Solder Paste is designed for maximum production efficiency.
5. High Electrical Reliability – Even Under Humidity
With SIR values exceeding 1.7×10⁹ Ω (IPC) and 6.4×10¹² Ω (Bellcore), and passing 500‑hour electromigration tests, this Fine-Pitch Solder Paste ensures that the residue remains electrically safe over the product's lifetime. This is essential for automotive and telecommunications applications where long‑term reliability is non‑negotiable.
6. Cost‑Effective Formulation – Low Silver Content
With silver content reduced to 0.3–0.5%, TS‑503 offers significant material cost savings compared to higher‑silver pastes. This makes it an attractive Fine-Pitch Solder Paste for high‑volume production, where cost efficiency is as important as print performance. The Solder paste type 4 formulation balances performance with affordability.
Recommended Application Parameters
Stencil Design Guidelines for Fine-Pitch Solder Paste
Stencil Technologies: Electroformed and laser‑cut stencils with electro‑polishing provide optimal printing characteristics. For Solder paste type 4, a stencil thickness of 100–125 μm is recommended to achieve the ideal aspect ratio for fine apertures. "Roof‑shaped" aperture designs help reduce solder balling between components.
Printing Conditions
Reflow Profile (Recommended)
Storage and Handling Guidelines
Alloy Composition Overview
Typical Applications for This Fine-Pitch Solder Paste
TS‑503 is ideal for applications that require fine‑pitch printing and medium‑temperature reflow:
As a versatile Fine-Pitch Solder Paste, TS‑503 delivers consistent printing on these demanding applications. The Solder paste type 4 classification ensures reliable fine‑pitch performance across all these industries.
Quality Assurance
Every batch of TENSAN TS‑503 is accompanied by a Certificate of Analysis confirming:
Our rigorous quality control ensures that every shipment of this Fine-Pitch Solder Paste meets the same high standards of printability and reliability.
Frequently Asked Questions
Q: What is the powder size of TS-503?
A: TS‑503 uses Solder paste type 4 powder, with a particle size range of 20–38 μm. This is a standard Solder paste type 4 classification per IPC standards, ideal for Fine-Pitch Solder Paste applications.
Q: What pitch sizes can this Fine-Pitch Solder Paste support?
A: TS‑503 reliably prints down to 0.25 mm (10 mil) pitch, making it ideal for fine‑pitch QFP, QFN, and BGA components. The Solder paste type 4 powder ensures good aperture filling for these small openings.
Q: Is TS‑503 compatible with my current stencil design for fine‑pitch printing?
A: Yes, if you are already using a Solder paste type 4 product, TS‑503 is a direct replacement. We recommend an aspect ratio (width/thickness) of at least 1.5 for optimal transfer with this Fine-Pitch Solder Paste.
Q: Does this Fine-Pitch Solder Paste require nitrogen reflow?
A: No, it performs well in air. Nitrogen can further improve wetting on difficult finishes but is not required.
Q: What is the shelf life of this Solder paste type 4 product?
A: Six months from production date when stored at 5–10°C.
Q: Can I mix leftover TS‑503 with fresh paste?
A: No. Do not mix leftover solder paste with new paste. Always use fresh paste from the jar after proper mixing.
Conclusion
For manufacturers who demand fine‑pitch capability and medium‑temperature processing, TENSAN TS‑503 is the definitive Fine-Pitch Solder Paste solution. This Solder paste type 4 product offers exceptional printability, stable viscosity, no‑clean convenience, and proven electrical reliability – all with a lower reflow temperature that protects sensitive components.
By choosing TS‑503, you select a Fine-Pitch Solder Paste that:
Upgrade to TENSAN TS‑503 – the Fine-Pitch Solder Paste that combines print performance with thermal protection and reliability.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
