High ICT ProbeTest Yield Solder Paste

TS107E is a widely used no‑clean, leaded solder paste that is specifically engineered to deliver exceptional performance in in‑circuit testing (ICT). As a High ICT Probe‑Test Yield Solder Paste, it provides the industry's best High probe test yield, ensuring reliable electrical contact, minimal false failures, and reduced test‑time costs. Beyond its superior probe‑test characteristics, TS107E also offers excellent ultra‑fine pitch printing, low voiding, and robust reliability, making it the preferred choice for high‑volume electronics manufacturing where test yield is critical.

Solder Paste Composition

TS107E High ICT Probe‑Test Yield Solder Paste consists of Sn63/Pb37 alloy powder and solder flux. According to the technical datasheet, this product uses the Sn63/Pb37 eutectic alloy (63% tin, 37% lead) with a melting point of 183°C. The flux content is approximately 5% (by weight), utilising an ROL0‑grade activator system (the highest reliability level per IPC J‑STD‑004). This formulation is carefully balanced to leave minimal, colourless, and transparent residue after reflow – a key enabler for High probe test yield, as thin, non‑conductive residues reduce probe contact resistance and prevent false readings during ICT.

Solder Paste Type – Customisable Powder Size Options

TS107E High ICT Probe‑Test Yield Solder Paste is available in a wide range of powder sizes to suit different printing and dispensing needs, while maintaining its outstanding High probe test yield across all variants. The product family offers the industry’s broadest selection of Solder Paste Type options, including:

Regardless of the powder type chosen, TS107E consistently delivers industry‑leading High probe test yield, ensuring that ICT probing is accurate, stable, and repeatable across all board designs.

Sn63/Pb37 Alloy Advantages

As a typical High ICT Probe‑Test Yield Solder Paste, TS107E utilises the Sn63/Pb37 eutectic alloy, offering the following core benefits:

• Eutectic characteristics – melting point of 183°C, no plastic zone, rapid solidification during soldering, reducing cold solder risks;
• Mature technology – Sn63/Pb37 is the most widely applied alloy system, and its well‑characterised wetting behaviour ensures consistent joint morphology, which contributes to High probe test yield by providing uniform probe‑contact surfaces;
• Superior wettability – excellent performance across various PCB surface finishes, especially on CuOSP, promoting reliable joint formation;
• Cost‑effectiveness – compared to lead‑free alloys, this product offers competitive material costs while delivering superior probe test performance.

This alloy system, combined with the optimised flux, ensures that TS107E produces smooth, bright, and residue‑free solder joints, which directly translates into High probe test yield during ICT.

Flux and Electrical Reliability

The flux in TS107E employs an ROL0‑grade activator system (IPC J‑STD‑004 highest reliability level) and is halogen‑containing (confirmed by titration and silver halide tests). This flux system ensures that the High ICT Probe‑Test Yield Solder Paste passes all of the following tests, while also providing the low‑residue characteristics essential for High probe test yield:

These results confirm that the flux residue is not only electrically safe but also dry and transparent, which minimises probe‑tip contamination and supports High probe test yield by maintaining low and stable contact resistance over thousands of test cycles.

Printing Performance and Process Parameters

TS107E High ICT Probe‑Test Yield Solder Paste demonstrates outstanding printing consistency and high process capability index (Cpk) on the printer, even at ultra‑fine pitch. The key printing parameters for this product are:

• Printing speed: 25–150mm/s (1–6 in/s), supporting high‑speed printing for fast cycle times and high throughput;
• Squeegee pressure: 0.18–0.27kg/cm (1.0–1.5lbs/inch); higher speeds require increased pressure;
• Squeegee angle: 60° (standard);
• Squeegee material: metal or polyurethane rubber (hardness 80–90 Shore);
• Stencil thickness: 100–150μm (4–6mil);
• Stencil separation speed: 3–10mm/s;
• Stencil material: recommended Alpha series electroformed/laser‑cut stencils.

This product exhibits minimal viscosity variation during continuous printing at 25°C/50%RH, significantly reducing cleaning frequency and improving production line efficiency. Consistent deposit geometry not only ensures reliable soldering but also contributes to High probe test yield by providing uniform joint heights and surface conditions, which are essential for repeatable probe contact.

Handling and Process Guidelines

TS107E High ICT Probe‑Test Yield Solder Paste must be stored refrigerated at 0–10°C (shelf life: 6 months). Prior to use, the paste should be allowed to warm to room temperature for approximately 4 hours (ensure temperature ≥19°C before opening), and then mixed:

• Manual mixing: can be stirred with a spatula until uniform;
• Centrifugal mixer (solder paste mixer): recommended speed below 300 RPM, with a pause after every 30–60 seconds of mixing;
• Important: Never mix solder paste recovered from the stencil with unused paste in the same container, as this will alter the rheological properties of the unused High ICT Probe‑Test Yield Solder Paste.

After printing, reflow should be completed as soon as possible. The reflow profile recommends a peak temperature of 210–220°C (above the 183°C melting point), and can be performed in air or nitrogen atmospheres. Proper handling and reflow help preserve the low‑residue characteristics, directly supporting High probe test yield.

Core Differentiating Advantages – Superior Probe Test Yield and More

TS107E High ICT Probe‑Test Yield Solder Paste offers three industry‑leading advantages:

• Best‑in‑class High probe test yield – This product is specifically optimised to deliver the highest High probe test yield in the industry. After reflow, the solder joints are covered with a minimal, colourless, transparent flux residue that does not insulate or contaminate probe tips. This results in low and stable contact resistance, significantly reducing false failures and test‑time retries in ICT, and ultimately improving first‑pass yield and manufacturing efficiency.
• Low head‑in‑pillow defect rate – While the primary focus is on probe testability, TS107E also provides outstanding resistance to head‑in‑pillow defects in BGA/CSP soldering, reducing open defects caused by PCB warpage and component coplanarity issues – ensuring that the joints themselves are electrically sound before they even reach the tester.
• Low voiding – Meets IPC 7095 Class III voiding performance (the highest level), ensuring long‑term reliability in thermal cycling and high‑power applications, and also contributing to stable probe contact over the product lifetime.

Application Scenarios and Supply Capacity

TS107E High ICT Probe‑Test Yield Solder Paste has been deployed in volume production across the following sectors, where its High probe test yield delivers tangible improvements in test efficiency and cost reduction:

This High ICT Probe‑Test Yield Solder Paste serves over 50 customers, with a monthly production capacity exceeding 3 tonnes and ample inventory, enabling delivery within 48 hours.