Liquid Solder Flux
  • Liquid Solder Flux Liquid Solder Flux
  • Liquid Solder Flux Liquid Solder Flux
  • Liquid Solder Flux Liquid Solder Flux

Liquid Solder Flux

Model:TS503

In electronics assembly, the choice of solder flux is just as critical as the alloy itself. Whether for wave soldering, selective soldering, or PCB repair and rework, a high‑quality Liquid Solder Flux ensures excellent wetting, strong joint formation, and reliable electrical performance. TENSAN offers advanced Liquid Solder Flux formulations engineered to meet the demands of modern SMT and through‑hole assembly processes. With low‑residue, no‑clean characteristics, compatibility with lead‑free and tin‑lead alloys, and stable performance across a wide range of operating conditions, this solder flux delivers the consistency and reliability that manufacturers require. As a Liquid Solder Flux, TENSAN's solution is ideal for wave soldering, selective soldering, and rework applications – providing the perfect balance of activity, residue cleanliness, and process stability.

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Product Description

Liquid Solder Flux – TENSAN High-Performance Soldering Solution

In electronics assembly, the choice of solder flux is just as critical as the alloy itself. Whether for wave soldering, selective soldering, or PCB repair and rework, a high‑quality Liquid Solder Flux ensures excellent wetting, strong joint formation, and reliable electrical performance. TENSAN offers advanced Liquid Solder Flux formulations engineered to meet the demands of modern SMT and through‑hole assembly processes. With low‑residue, no‑clean characteristics, compatibility with lead‑free and tin‑lead alloys, and stable performance across a wide range of operating conditions, this solder flux delivers the consistency and reliability that manufacturers require. As a Liquid Solder Flux, TENSAN's solution is ideal for wave soldering, selective soldering, and rework applications – providing the perfect balance of activity, residue cleanliness, and process stability.

What Is TENSAN Liquid Solder Flux?

TENSAN Liquid Solder Flux is a high‑performance, no‑clean solder flux designed for automated and manual soldering processes. This advanced solder flux formulation offers:


  • Excellent wetting – Superior spread and adhesion on copper, brass, nickel, and other common PCB finishes
  • Low‑residue, no‑clean – Clear, non‑corrosive, and non‑conductive residue that supports ICT testing without cleaning
  • Compatibility with multiple alloys – Works with lead‑free (SAC305, SnAgBi, Sn100C) and tin‑lead (Sn63/Pb37) alloys
  • Wide application compatibility – Suitable for spray, foaming, and drop‑jet fluxing systems
  • Halide‑free options – Meets strict environmental and reliability standards
  • Long shelf life – Stable performance when stored properly


As a versatile Liquid Solder Flux, TENSAN's solution is trusted by manufacturers across automotive, telecommunications, consumer electronics, and industrial applications.

Key Specifications

Physical & Chemical Properties

Chemical & Electrical Propertiesv

Why Choose TENSAN Liquid Solder Flux?

1. Excellent Wetting and Solderability

TENSAN Liquid Solder Flux is formulated with carefully balanced activators that effectively remove surface oxides from copper, brass, nickel, and other common PCB finishes. This ensures rapid, uniform wetting, producing bright, well‑formed solder joints with minimal defects. Whether you are wave soldering high‑volume PCBs or performing selective soldering on dense assemblies, this solder flux delivers consistent, reliable performance.

2. Low‑Residue, No‑Clean Convenience

The solder flux system leaves a clear, non‑corrosive, and non‑conductive residue that does not require removal in most applications. This eliminates post‑soldering cleaning steps, reducing chemical costs, cycle time, and environmental impact. The low‑solids formulation ensures that residues are virtually invisible, supporting ICT and functional testing without interference.

3. Wide Process Compatibility

TENSAN Liquid Solder Flux is compatible with a broad range of application methods, including:


  • Spray fluxing – For high‑speed, uniform coating
  • Foam fluxing – For through‑hole and mixed‑technology boards
  • Drop‑jet fluxing – For precise, selective application


This versatility makes it suitable for both high‑volume production lines and low‑volume, high‑mix manufacturing environments.

4. Multi‑Alloy Compatibility

This Liquid Solder Flux works effectively with both lead‑free and tin‑lead alloys, including:


  • SAC305 (Sn96.5Ag3.0Cu0.5)
  • Sn100C (SnCuNiGe)
  • Sn63/Pb37
  • SnAgBi alloys


This broad compatibility simplifies material management and reduces the need for multiple flux formulations across different production lines.

5. Halide‑Free Formulation

TENSAN Liquid Solder Flux is available in halide‑free formulations, meeting strict environmental and reliability standards. This reduces the risk of ionic contamination and corrosion, making it ideal for high‑reliability applications in automotive, telecommunications, and medical electronics.

6. Stable Performance and Long Shelf Life

When stored properly in sealed containers, this solder flux maintains its performance characteristics for extended periods. The stable specific gravity and acid number ensure consistent flux activity, reducing the need for frequent adjustments and quality checks.

Recommended Application Parameters

Storage and Handling Guidelines


Typical Applications for This Liquid Solder Flux

TENSAN Liquid Solder Flux is ideal for a wide range of soldering applications:


  • Wave Soldering – Through‑hole and mixed‑technology PCBs
  • Selective Soldering – Dense assemblies with heat‑sensitive components
  • PCB Repair and Rework – Touch‑up and component replacement
  • Automotive Electronics – ECUs, sensors, lighting modules
  • Telecommunications – Base stations, RF modules, infrastructure equipment
  • Consumer Electronics – Power supplies, control boards, appliances
  • Industrial Controls – PLCs, motor drives, power electronics


As a versatile Liquid Solder Flux, TENSAN's solution is trusted by manufacturers across these diverse industries for its consistent performance and reliability.

Quality Assurance

Every batch of TENSAN Liquid Solder Flux is accompanied by a Certificate of Analysis confirming:


  • Product model and batch number
  • Solder flux type and classification
  • Specific gravity and acid number
  • Halogen contentSIR and corrosion test results


Our rigorous quality control ensures consistent solder flux performance from lot to lot, giving you confidence in every production run.

Frequently Asked Questions

Q: What is the difference between liquid solder flux and solder paste flux?

A: Liquid Solder Flux is a standalone flux applied separately from the solder alloy, typically used in wave soldering, selective soldering, or manual soldering. Solder paste flux is combined with solder powder in a paste formulation for SMT printing and reflow. TENSAN Liquid Solder Flux offers the same high‑quality flux chemistry in a convenient liquid form for through‑hole and mixed‑technology assemblies.

Q: Is this Liquid Solder Flux compatible with lead‑free alloys?

A: Yes. This solder flux works effectively with both lead‑free alloys (SAC305, Sn100C, SnAgBi) and traditional tin‑lead alloys, providing flexibility across different production lines.

Q: Does this Liquid Solder Flux require post‑soldering cleaning?

A: No. This is a no‑clean solder flux formulated to leave a clear, non‑corrosive, and non‑conductive residue that can safely remain on the board. Cleaning is not required for most applications.

Q: What is the shelf life of this Liquid Solder Flux?

A: Up to 3 years when stored unopened at 10–32°C (50–90°F). Always keep the container sealed to prevent solvent evaporation and contamination.

Q: Can this Liquid Solder Flux be used in foam fluxing systems?

A: Yes. This solder flux is compatible with spray, foaming, and drop‑jet fluxing systems, making it suitable for a wide range of production equipment.

Q: Is this Liquid Solder Flux halide‑free?

A: Halide‑free options are available, meeting strict environmental and reliability standards for automotive, telecommunications, and medical applications.

Conclusion

For manufacturers who demand reliable, consistent soldering performance across wave, selective, and manual soldering processes, TENSAN Liquid Solder Flux is the definitive solution. This solder flux offers excellent wetting, low‑residue no‑clean convenience, wide process compatibility, and proven reliability – all backed by rigorous quality assurance.

By choosing TENSAN Liquid Solder Flux, you select a solder flux that:


  • Delivers excellent wetting and solderability on all common PCB finishes
  • Eliminates cleaning steps with low‑residue, no‑clean formulation
  • Works with both lead‑free and tin‑lead alloys for production flexibility
  • Supports spray, foam, and drop‑jet application methods
  • Meets strict environmental and reliability standards
  • Offers stable, long‑shelf‑life performance


Upgrade to TENSAN Liquid Solder Flux – the solder flux that combines performance, reliability, and convenience.

Contact Information

TENSAN VIETNAM CO., LTD

TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam

Tel: +84‑222‑650‑8818

Email: mark@sztensan.com






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