TENSAN TS‑506 is a Low Residue Clean Flux Solder Paste with Superior Cleanliness. Its advanced no‑clean flux system is specifically formulated to leave a transparent, thin, and electrically safe residue after reflow, while delivering excellent wetting, low voiding, and stable printing. With halogen content below 500 ppm (L0 grade), passing stringent copper mirror corrosion and SIR tests, TS‑506 sets a new standard for solder paste flux residue cleanliness – making it the ideal choice for high‑reliability, no‑clean applications across automotive, telecom, medical, and consumer electronics.
Low Residue Clean Flux Solder Paste with Superior Cleanliness – TENSAN TS-506
In many advanced SMT assemblies, post‑reflow cleaning is undesirable or even impossible – due to sensitive components, low standoff devices, or simply to reduce process steps and chemical usage. Yet, residue from solder paste must not compromise electrical reliability, testability, or conformal coating adhesion. This is why modern electronics manufacturers place a premium on solder paste flux residue cleanliness – the ability of a paste to leave behind minimal, non‑conductive, non‑corrosive residues that do not interfere with PCB functionality.
TENSAN TS‑506 is a Low Residue Clean Flux Solder Paste with Superior Cleanliness. Its advanced no‑clean flux system is specifically formulated to leave a transparent, thin, and electrically safe residue after reflow, while delivering excellent wetting, low voiding, and stable printing. With halogen content below 500 ppm (L0 grade), passing stringent copper mirror corrosion and SIR tests, TS‑506 sets a new standard for solder paste flux residue cleanliness – making it the ideal choice for high‑reliability, no‑clean applications across automotive, telecom, medical, and consumer electronics.
What Is TENSAN TS‑506?
TENSAN TS‑506 is a lead‑free, no‑clean solder paste for SMT assembly that offers:
TS‑506 is the go‑to solder paste flux residue cleanliness solution for manufacturers who need reliable no‑clean performance without sacrificing process robustness.
Key Specifications
Alloy & Physical Properties
Electrical & Reliability Properties
Why Choose TENSAN TS‑506 as Your Low Residue Clean Flux Solder Paste with Superior Cleanliness?
1. Minimal Residue – Cleaner Boards, Better Testability
After reflow, TS‑506 leaves only about 5% (w/w) of the original flux content as a thin, transparent, and barely visible film. This residue does not obscure component markings, does not attract dust, and is easily penetrated by ICT and flying‑probe test needles. Unlike some pastes that leave sticky or discoloured residues, TS‑506’s residue is dry and solid, ensuring consistent probe contact and reducing false failures. This is a direct result of its engineered solder paste flux residue cleanliness – a key differentiator for high‑volume producers.
2. Superior Electrical Cleanliness – High SIR and Low Halogens
Cleanliness is not just about appearance; it is about electrical safety. TS‑506 passes surface insulation resistance (SIR) tests with significant margin: ≥1.0×10⁸ Ω at 40°C/90% RH and ≥5.0×10⁸ Ω at 80°C/85% RH. The halogen content is below 500 ppm (L0 grade), meeting the strictest industry definitions of halogen‑free. This low ionic contamination ensures that even under humid and biased conditions, the residue does not cause leakage or electrochemical migration. For designers of high‑impedance circuits or sensitive RF modules, this solder paste flux residue cleanliness is non‑negotiable.
3. Non‑Corrosive Residue – Passes Copper Mirror and Silver Chromate
Corrosion can lead to open circuits, intermittent failures, and field returns. TS‑506’s residue has been validated by the copper mirror test (IPC‑TM‑650 2.3.32) with no penetrating corrosion (L grade), and by the silver chromate test with no discoloration. This confirms that the flux chemistry does not attack copper, silver, or other PCB metallisations, preserving pad integrity and solder joint strength over the product’s lifetime.
4. Residue Dryness – No Sticky Contamination
The residue dryness test (per JIS Z 3284) shows that TS‑506 leaves a dry, non‑tacky residue. This is particularly important for boards that will be handled, stacked, or subjected to conformal coating – sticky residues can trap dust, impede coating adhesion, and complicate assembly handling. TS‑506’s dry residue simplifies post‑reflow handling and ensures compatibility with automated optical inspection (AOI).
5. Excellent Wetting and Low Voiding – Without Compromising Cleanliness
Often, pastes that reduce residue may compromise wetting or increase voiding. TS‑506 balances all three: it provides strong wetting on ENIG, OSP, HASL, and immersion finishes, achieves low voiding (<15% on thermal pads), and maintains its superior cleanliness – a testament to its advanced flux formulation. This makes it a truly versatile Low Residue Clean Flux Solder Paste with Superior Cleanliness.
Storage and Handling Guidelines
Important: Always warm up TS‑506 in its sealed container to prevent moisture condensation, which can affect residue cleanliness and increase voiding.
Recommended Temperature Curvev
Following the recommended profile ensures complete flux activation and thorough evaporation of volatiles, resulting in the cleanest residue possible – a key factor in achieving optimal solder paste flux residue cleanliness.
Typical Applications
This Low Residue Clean Flux Solder Paste with Superior Cleanliness is ideal for:
Automotive electronics – ECUs, sensors, BMS, lighting – where long‑term reliability under heat and humidity is critical
Telecommunications – 5G base stations, RF modules, high‑frequency PCBs – where low leakage and signal integrity are essential
Medical devices – Implantable and diagnostic equipment – requiring minimal outgassing and biocompatible residues
Consumer electronics – Smartphones, tablets, wearables – where cleaning is not economically viable
Industrial controls – PLCs, motor drives – where boards are often coated and residues must not interfere
In all these fields, solder paste flux residue cleanliness is a key quality metric, and TS‑506 delivers consistently.
Quality Assurance
Every batch of TENSAN TS‑506 is accompanied by a Certificate of Analysis confirming:
Our rigorous testing includes the residue cleanliness tests described above, ensuring that each batch meets the same high standards.
Frequently Asked Questions
Q: What is the residue amount left after reflow?
A: TS‑506 leaves approximately 5% of the original flux content (by weight) as residue – a very thin, transparent layer that is barely visible. This is a direct measure of its excellent solder paste flux residue cleanliness.
Q: Does TS‑506 require cleaning for high‑reliability applications?
A: No. TS‑506 is classified as no‑clean and passes SIR, corrosion, and halogen‑free tests. It can be used without cleaning, even in automotive and medical applications, reducing process steps and chemical costs.
Q: How does TS‑506 compare to other no‑clean pastes in terms of residue?
A: TS‑506 is formulated to leave a drier, thinner, and more transparent residue than many standard no‑clean pastes, and it has lower halogen content, making it superior in terms of solder paste flux residue cleanliness.
Q: Is the residue compatible with conformal coating?
A: Yes. The dry, non‑tacky residue is compatible with most acrylic, silicone, and urethane coatings. It does not interfere with adhesion or cause outgassing under coating.
Q: Can TS‑506 be used for boards with high‑impedance analog circuits?
A: Absolutely. Its high SIR values and low ionic contamination ensure minimal leakage, preserving signal integrity in sensitive analog and RF sections.
Q: What is the shelf life of TS‑506?
A: Six months from production date when stored at 2–10°C.
Conclusion
For manufacturers who demand the cleanest possible no‑clean process, TENSAN TS‑506 is the definitive answer. As a Low Residue Clean Flux Solder Paste with Superior Cleanliness, it combines minimal residue, high SIR, non‑corrosive chemistry, and excellent handling properties – all while providing outstanding wetting, voiding control, and printability. By choosing TS‑506, you eliminate post‑reflow cleaning, reduce chemical exposure, and ensure that your PCBs meet the highest electrical reliability standards.
This is the solder paste flux residue cleanliness that today's high‑reliability electronics demand. Upgrade to TENSAN TS‑506 – where cleanliness meets performance.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
