TS‑503 is the ideal SnAgBi solder paste choice for LED lighting, consumer electronics, flexible PCBs, and other heat‑sensitive assemblies – providing the perfect balance of thermal protection, reliability, and cost‑effectiveness
Low-Temperature SnAgBi Solder Paste – TENSAN TS-503 Solution
In modern SMT assembly, the demand for SnAgBi solder paste has grown significantly as manufacturers seek alternatives that balance lower processing temperatures with reliable joint performance and cost efficiency. TENSAN TS‑503 is a Low-Temperature SnAgBi Solder Paste engineered specifically for applications where heat‑sensitive components, flexible substrates, and step‑soldering processes require reduced thermal exposure. This advanced SnAgBi solder paste features a unique Sn‑Ag0.3‑Bi35 alloy, delivering significantly lower reflow temperatures than conventional SAC305 pastes while maintaining excellent wettability, low voiding, and stable printing performance. As a Low-Temperature SnAgBi Solder Paste, TS‑503 is the ideal SnAgBi solder paste choice for LED lighting, consumer electronics, flexible PCBs, and other heat‑sensitive assemblies – providing the perfect balance of thermal protection, reliability, and cost‑effectiveness.
What Is TENSAN TS-503 Low-Temperature SnAgBi Solder Paste?
TENSAN TS‑503 is a lead‑free, no‑clean Low-Temperature SnAgBi Solder Paste designed for SMT assembly processes that demand reduced reflow temperatures and consistent performance. This advanced SnAgBi solder paste is formulated with a Sn‑Ag0.3‑Bi35 alloy, offering:Lower reflow temperature – Bismuth content (34.5–35.5%) significantly reduces melting point to 210–230°C peak, protecting heat‑sensitive componentsLow silver content – Silver content reduced to 0.3–0.5%, offering material cost savings while maintaining excellent soldering performanceExcellent printability – Type 4 powder (20–38 μm) ensures consistent deposit volume for fine‑pitch applicationsNo‑clean convenience – Minimal, clear residue that supports ICT testing without cleaningFull RoHS compliance – 100% lead‑free, meeting global environmental standardsHigh reliability – Passes SIR and electromigration tests for long‑term electrical stabilityAs a Low-Temperature SnAgBi Solder Paste, TS‑503 is trusted by manufacturers across LED lighting, consumer electronics, automotive, and telecommunications industries for its consistent performance and thermal protection capabilities. This SnAgBi solder paste delivers the reliability of bismuth‑containing alloys at a process‑friendly temperature profile.
Key SpecificationsAlloy Composition & Physical Properties
Chemical & Electrical Properties
Physical Properties
Why Choose TENSAN TS-503 as Your Low-Temperature SnAgBi Solder Paste?
1. Unique Bi35 Composition – Significantly Lower Reflow Temperatures
TS‑503 uses a Sn‑Ag0.3‑Bi35 alloy that significantly reduces the melting point compared to standard SAC305. The peak reflow temperature of 210–230°C protects heat‑sensitive components such as LEDs, plastic connectors, and flexible substrates from thermal degradation. This makes this Low-Temperature SnAgBi Solder Paste the ideal choice for assemblies that cannot tolerate high temperatures, while still providing strong, reliable joints. As a SnAgBi solder paste, TS‑503 delivers the reliability of bismuth‑containing alloys at a more forgiving temperature profile – a key advantage for modern electronics manufacturing.
2. Low Silver Content – Cost‑Effective Formulation
With silver content reduced to 0.3–0.5% (compared to 3.0% in SAC305), TS‑503 offers significant material cost savings while maintaining excellent soldering performance. This Low-Temperature SnAgBi Solder Paste provides the perfect balance between cost and reliability, making it an attractive SnAgBi solder paste choice for high‑volume production. The bismuth‑rich formulation reduces raw material expenses without compromising joint quality.
3. Excellent Printability – Consistent Fine‑Pitch Performance
With Type 4 powder (20–38 μm), TS‑503 delivers:
Whether you use an automatic printer or manual equipment, this Low-Temperature SnAgBi Solder Paste adapts to your process requirements, ensuring high first‑pass yields.
4. No‑Clean, Low‑Residue – Saves Process Steps
The flux system leaves a clear, non‑conductive residue that:
This no‑clean design makes TS‑503 a highly efficient SnAgBi solder paste for high‑volume production.
5. Long Stencil Life and Stable Viscosity
TS‑503 maintains consistent viscosity for:
This stability ensures that your Low-Temperature SnAgBi Solder Paste printer operates at peak efficiency with minimal interruptions.
6. High Electrical Reliability – Essential for Long‑Term Performance
With SIR exceeding 1.7×10⁹ Ω (IPC) and 6.4×10¹² Ω (Bellcore), and passing 500‑hour electromigration testing, TS‑503 ensures that the residue left by this SnAgBi solder paste does not compromise long‑term reliability – even in humid environments. This makes it a trusted Low-Temperature SnAgBi Solder Paste for automotive, telecommunications, and industrial applications.
Recommended Application Parameters
Stencil Design Guidelines
Stencil Technologies: Electroformed and laser‑cut stencils with electro‑polishing provide optimal printing characteristics. "Roof‑shaped" aperture designs help reduce solder balling between components.
Printing Conditions
Reflow Profile (Recommended)
The lower peak temperature of this Low-Temperature SnAgBi Solder Paste provides a protective thermal environment for heat‑sensitive components while still delivering strong, reliable solder joints. Adjust profiles based on your specific reflow oven and PCB assembly requirements.
Storage and Handling Guidelines
Alloy Composition Overview
Typical Applications for This Low-Temperature SnAgBi Solder Paste
TS‑503 is ideal for applications requiring lower reflow temperatures and environmental compliance:LED Lighting – Protects LED chips and phosphor layers from thermal degradationConsumer Electronics – Smartphones, tablets, wearables with heat‑sensitive componentsAutomotive Electronics – Sensors, lighting modules, ECUs requiring medium‑temperature solderingFlexible PCBs – Prevents warpage and delamination of flexible substratesStep‑Soldering Processes – Secondary reflow after high‑temperature SAC assemblyTelecommunications – RF modules, base station componentsHeat‑Sensitive Components – Thermal devices, thermistors, and similar componentsAs a versatile SnAgBi solder paste, TS‑503 is trusted by manufacturers across these diverse industries for its reliable low‑temperature performance.Quality AssuranceEvery batch of TENSAN TS‑503 is accompanied by a Certificate of Analysis confirming:Model and batch numberAlloy composition (Sn‑Ag0.3‑Bi35) – verified SnAgBi solder paste formulationPowder size distribution (Type 4, 20–38 μm)Flux content (wt%)Viscosity at 25°COur manufacturing processes ensure consistent solder paste quality from lot to lot, giving you confidence in every production run with this Low-Temperature SnAgBi Solder Paste.
Frequently Asked Questions
Q: What makes TS‑503 a low-temperature SnAgBi solder paste?
A: TS‑503 uses a Sn‑Ag0.3‑Bi35 alloy with high bismuth content (34.5–35.5%), which significantly lowers the melting point compared to SAC305. This Low-Temperature SnAgBi Solder Paste achieves peak reflow at 210–230°C, protecting heat‑sensitive components.
Q: How does this SnAgBi solder paste differ from SAC305?
A: TS‑503 contains bismuth (34.5–35.5%) and lower silver (0.3–0.5% vs 3.0%). This SnAgBi solder paste has a significantly lower melting point, making it ideal for heat‑sensitive applications where SAC305 would cause thermal damage.
Q: Is TS‑503 compatible with standard SMT equipment?
A: Yes. This Low-Temperature SnAgBi Solder Paste works with all standard automatic and semi‑automatic printers, as well as standard reflow ovens. Its Type‑4 powder supports fine‑pitch printing down to 0.25 mm.
Q: Does TS‑503 require post‑reflow cleaning?
A: No. TS‑503 is a no‑clean SnAgBi solder paste. The residue is clear, non‑conductive, and compatible with ICT testing, eliminating cleaning steps and reducing costs.
Q: What is the shelf life of this Low-Temperature SnAgBi Solder Paste?
A: Six months from production date when stored at 5–10°C. At room temperature, it can be kept for up to 15 days.
Q: Can TS‑503 be used for nitrogen reflow?
A: Yes, it performs well in both air and nitrogen reflow environments.
Q: What industries commonly use this SnAgBi solder paste product?
A: TS‑503 is widely used in LED lighting, consumer electronics, automotive, flexible PCB, and telecommunications manufacturing – anywhere that low‑temperature reflow and reliable SnAgBi performance are required.
Conclusion
For manufacturers who demand lower processing temperatures without compromising solder joint quality, TENSAN TS‑503 is the definitive Low-Temperature SnAgBi Solder Paste solution. This SnAgBi solder paste offers excellent printability, stable viscosity, no‑clean convenience, and proven electrical reliability – all at a cost‑effective low‑silver composition.
By choosing TS‑503, you select a Low-Temperature SnAgBi Solder Paste that:
Meets full RoHS compliance as a lead‑free productReduces material costs with low silver content (0.3–0.5%)Upgrade to TENSAN TS‑503 – the Low-Temperature SnAgBi Solder Paste that combines performance, protection, and cost efficiency.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
