Low Voiding Performance Lead-Free Solder Paste – TENSAN TS‑506 is a no‑clean, SAC‑based solder paste engineered with an advanced flux system that actively minimises gas entrapment during reflow. With its Sn98.5Ag1.0Cu0.5 alloy and Type‑4 powder, TS‑506 delivers consistently low voiding rates across a wide range of pad sizes and surface finishes, while maintaining excellent printability and wetting.
Low Voiding Performance Lead-Free Solder Paste – TENSAN TS-506
In modern electronics assembly, voiding in solder joints remains one of the most persistent quality challenges. Voids reduce thermal conductivity, impair current carrying capacity, and act as stress concentrators that shorten product lifetimes – especially in power devices, QFN packages, and BGA components. That is why selecting a solder paste with low voiding performance is critical for achieving both immediate yield and long‑term reliability.
Low Voiding Performance Lead-Free Solder Paste – TENSAN TS‑506 is a no‑clean, SAC‑based solder paste engineered with an advanced flux system that actively minimises gas entrapment during reflow. With its Sn98.5Ag1.0Cu0.5 alloy and Type‑4 powder, TS‑506 delivers consistently low voiding rates across a wide range of pad sizes and surface finishes, while maintaining excellent printability and wetting.
What Is TENSAN TS‑506?
TENSAN TS‑506 is a lead‑free, no‑clean solder paste for SMT assembly that offers:
TS‑506 is the ideal choice for manufacturers who demand a solder paste with low voiding performance for power modules, automotive electronics, and high‑density consumer devices.
Key Specifications
Alloy & Physical Properties
Electrical & Reliability Properties
Why Choose TENSAN TS‑506 as Your Low Voiding Performance Lead-Free Solder Paste?
1. Engineered for Minimal Voiding
Void formation is primarily caused by trapped flux outgassing and moisture evaporation during reflow. TS‑506’s flux chemistry is designed to provide a wide, controlled outgassing window during the preheat and soak zones, allowing volatiles to escape cleanly before the alloy melts. This results in voiding levels consistently below 15% on large thermal pads – significantly outperforming many standard pastes. Whether you are assembling QFN, LGA, or large discrete power components, this solder paste with low voiding performance ensures better thermal transfer and mechanical strength.
2. Reliable Electrical Performance Under Humidity
Low voiding alone is not enough; the residue must remain stable under harsh conditions. TS‑506 passes SIR tests at both 40°C/90% RH and 80°C/85% RH with margin, and its halogen content meets L0 grade (<500 ppm). This makes it a solder paste with low voiding performance that you can trust for high‑reliability applications, including automotive and industrial controls.
3. Excellent Wetting and Joint Strength
Despite its lower silver content, TS‑506 exhibits rapid wetting on all common PCB finishes. The intermetallic layer formed is uniform and robust, providing strong adhesion and resistance to thermal fatigue. Combined with low voiding, this ensures that solder joints are both electrically and mechanically sound.
4. Stable Printing for High‑Volume Production
Consistent deposit volume is essential for achieving low voiding – any variation can trap extra flux. TS‑506’s optimised rheology maintains transfer efficiency over long print runs (8+ hours) and supports print speeds from 25 to 150 mm/s. This stability reduces rework and makes this Low Voiding Performance Lead-Free Solder Paste an efficient choice for high‑mix SMT lines.
5. No‑Clean Residue with Full Testability
After reflow, the residue is transparent and leaves minimal ionic contamination, allowing ICT and flying‑probe testing without cleaning. This reduces process steps and chemical costs, while the low‑voiding characteristic ensures that test probes make reliable contact with the pads.
Storage and Handling Guidelines
Important: Always warm up TS‑506 in its sealed container to prevent moisture condensation, which can cause spattering and increased voiding. Proper handling is essential to fully realise its solder paste with low voiding performance.
Recommended Temperature Curve
For optimal low voiding, we recommend a slow preheat (≤2.5°C/s) and a sufficiently long soak (90–120s) to allow thorough outgassing, followed by a peak temperature 240–250°C for 20–40s to promote rapid coalescence and gas escape.
Typical Applications
TS‑506 is the preferred solder paste with low voiding performance across many industries:
Wherever thermal dissipation and joint integrity are critical, this Low Voiding Performance Lead-Free Solder Paste delivers consistent results.
Quality Assurance
Every batch of TENSAN TS‑506 comes with a Certificate of Analysis that confirms:
Our ISO‑certified production ensures that every shipment meets the same high standards of voiding control.
Frequently Asked Questions
Q: How does TS‑506 achieve low voiding on large pads?
A: The flux system is tuned to release volatiles gradually, combined with a recommended reflow profile that provides ample time for outgassing. This reduces gas entrapment significantly.
Q: Is TS‑506 suitable for nitrogen reflow?
A: Yes. It works well in both air and nitrogen. Nitrogen can further reduce oxidation and improve wetting, but is not required to achieve low voiding.
Q: What is the typical voiding rate for TS‑506?
A: In internal tests on QFN thermal pads (5×5 mm), voiding rates are consistently below 15%, and often below 10% with optimised stencil design.
Q: Does low voiding affect the shelf life?
A: No. The shelf life remains 6 months when stored at 2–10°C. Proper storage and handling are essential to maintain its low‑voiding properties.
Q: Can TS‑506 be used for fine‑pitch printing?
A: Yes, the Type‑4 powder (20–38 μm) supports pitches down to 0.25 mm (10 mil), making it a versatile solder paste with low voiding performance for dense boards.
Conclusion
Voiding is no longer an unavoidable defect – with TENSAN TS‑506, you can achieve consistently low voiding rates while maintaining excellent printability and electrical reliability. This Low Voiding Performance Lead-Free Solder Paste combines advanced flux chemistry with a cost‑effective low‑silver alloy, offering a balanced solution for today’s demanding SMT applications.
When you choose TS‑506, you are choosing a solder paste with low voiding performance that reduces thermal resistance, improves product life, and lowers rework rates. Whether you produce automotive power modules or consumer handheld devices, TS‑506 provides the voiding control you need.
Upgrade your SMT process with TENSAN TS‑506 – the lead‑free solder paste that puts performance first.
Contact Information
TENSAN VIETNAM CO., LTD
TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam
Tel: +84‑222‑650‑8818
Email: mark@sztensan.com
