Medium-Temperature Solder Paste与

Medium-Temperature Solder Paste – TENSAN TS-503 Low-Silver Solution

In modern electronics manufacturing, not all assemblies can withstand the high peak temperatures required by standard SAC305 solder paste. Heat‑sensitive components, flexible PCBs, LED modules, and multi‑step reflow processes demand a Medium-Temperature Solder Paste that can form reliable solder joints at lower temperatures without compromising quality. TENSAN TS‑503 is precisely such a solder paste 503 – a low‑silver, bismuth‑containing Medium-Temperature Solder Paste engineered to deliver excellent wetting, stable printing, and reliable joint formation at significantly reduced reflow temperatures. This solder paste 503 is the ideal choice for manufacturers seeking to protect thermal‑sensitive components while maintaining production efficiency and cost‑effectiveness.

What Is TENSAN TS-503 Medium-Temperature Solder Paste?

TENSAN TS‑503 is a lead‑free, no‑clean Medium-Temperature Solder Paste designed for SMT assembly processes that demand lower reflow temperatures and consistent performance. This advanced solder paste 503 is formulated with a Sn‑Ag0.3‑Bi35 alloy, offering:

• Lower reflow temperature – Bismuth content (34.5–35.5%) reduces melting point, protecting heat‑sensitive components
• Excellent printability – Type 4 powder (20–38 μm) ensures consistent deposit volume for fine‑pitch applications
• No‑clean convenience – Minimal, clear residue that supports ICT testing without cleaning
• Full RoHS compliance – 100% lead‑free, meeting global environmental standards
• Long stencil life – Stable rheology maintains print performance for >8 hours
• High reliability – Passes SIR and electromigration tests for long‑term electrical stability

As a Medium-Temperature Solder Paste, TS‑503 is trusted by manufacturers across LED lighting, automotive electronics, consumer devices, and telecommunications for its consistent performance and thermal protection capabilities. This solder paste 503 formulation delivers the ideal balance between process temperature and soldering quality.

Key SpecificationsAlloy Composition & Physical Properties

Chemical & Electrical Properties

Physical Properties

Why Choose TENSAN TS-503 as Your Medium-Temperature Solder Paste?

1. Unique Bi35 Alloy – Lower Reflow Temperatures

TS‑503 uses a Sn‑Ag0.3‑Bi35 alloy that significantly reduces the melting point compared to standard SAC305. The peak reflow temperature of 210–230°C protects heat‑sensitive components such as LEDs, plastic connectors, and flexible substrates from thermal degradation. This makes this Medium-Temperature Solder Paste the ideal choice for assemblies that cannot tolerate high temperatures, while still providing strong, reliable joints. As a solder paste 503 product, TS‑503 delivers the reliability of SAC alloys at a more forgiving temperature profile – a key advantage for modern electronics manufacturing.

2. Low Silver Content – Cost‑Effective Formulation

With silver content reduced to 0.3–0.5% (compared to 3.0% in SAC305), TS‑503 offers significant material cost savings while maintaining excellent soldering performance. This Medium-Temperature Solder Paste provides the perfect balance between cost and reliability, making it an attractive solder paste 503 choice for high‑volume production. The solder paste formulation reduces raw material expenses without compromising joint quality.

3. Excellent Printability – Consistent Fine‑Pitch Performance

With Type 4 powder (20–38 μm), TS‑503 delivers:

• Consistent paste volume transfer for fine‑pitch applications down to 0.25 mm
• Sharp edge definition and minimal slump after printing
• Compatibility with both standard and fine‑pitch stencil designs

Whether you use an automatic printer or manual equipment, this Medium-Temperature Solder Paste adapts to your process requirements, ensuring high first‑pass yields.

4. No‑Clean, Low‑Residue – Saves Process Steps

The flux system leaves a clear, non‑conductive residue that:

• Supports ICT (In‑Circuit Test) without post‑reflow cleaning
• Eliminates cleaning process steps, reducing chemical costs and cycle time
• Maintains high surface insulation resistance even under humid conditions (SIR > 1.7 × 10⁹ Ω)

This no‑clean design makes TS‑503 a highly efficient solder paste 503 product for high‑volume production.

5. Long Stencil Life and Stable Viscosity

TS‑503 maintains consistent viscosity for:

• Over 8 hours on stencil under normal production conditions (22°C, 50% RH)
• Reduced stencil cleaning frequency and less paste waste
• Stable printing performance across entire production shifts

This stability ensures that your Medium-Temperature Solder Paste printer operates at peak efficiency with minimal interruptions.

6. High Electrical Reliability – Essential for Long‑Term Performance

With SIR exceeding 1.7×10⁹ Ω (IPC) and 6.4×10¹² Ω (Bellcore), and passing 500‑hour electromigration testing, TS‑503 ensures that the residue left by this solder paste 503 does not compromise long‑term reliability – even in humid environments. This makes it a trusted Medium-Temperature Solder Paste for automotive, telecommunications, and industrial applications.

Recommended Application Parameters

Stencil Design Guidelines

Stencil Technologies: Electroformed and laser‑cut stencils with electro‑polishing provide optimal printing characteristics. "Roof‑shaped" aperture designs help reduce solder balling between components.

Printing Conditions

Reflow Profile (Recommended)

The lower peak temperature of this Medium-Temperature Solder Paste provides a protective thermal environment for heat‑sensitive components while still delivering strong, reliable solder joints. Adjust profiles based on your specific reflow oven and PCB assembly requirements.

Storage and Handling Guidelines

Important: Do not mix leftover solder paste with fresh paste in the same container. Always warm up this Medium-Temperature Solder Paste in its sealed container to prevent moisture condensation, which can cause spattering during reflow.

Alloy Composition Overview

Typical Applications for This Solder Paste 503 Product

TS‑503 is ideal for applications requiring medium‑temperature reflow and environmental compliance:

• LED Lighting – Protects LED chips and phosphor layers from thermal degradation
• Consumer Electronics – Smartphones, tablets, wearables with heat‑sensitive components
• Automotive Electronics – Sensors, lighting modules, ECUs requiring medium‑temperature soldering
• Flexible PCBs – Prevents warpage and delamination of flexible substrates
• Step‑Soldering Processes – Secondary reflow after high‑temperature SAC assembly
• Telecommunications – RF modules, base station components
• Heat‑Sensitive Components – Thermal devices, thermistors, and similar components

As a versatile solder paste 503 product, TS‑503 is trusted by manufacturers across these diverse industries for its reliable medium‑temperature performance.

Quality Assurance

Every batch of TENSAN TS‑503 is accompanied by a Certificate of Analysis confirming:

• Model and batch number
• Alloy composition (Sn‑Ag0.3‑Bi35)
• Powder size distribution (Type 4, 20–38 μm)
• lux content (wt%)
• Viscosity at 25°C

Our manufacturing processes ensure consistent solder paste quality from lot to lot, giving you confidence in every production run with this Medium-Temperature Solder Paste.

Frequently Asked Questions

Q: What makes TS‑503 a medium-temperature solder paste?

A: TS‑503 uses a Sn‑Ag0.3‑Bi35 alloy with high bismuth content (34.5–35.5%), which significantly lowers the melting point compared to SAC305. This Medium-Temperature Solder Paste achieves peak reflow at 210–230°C, protecting heat‑sensitive components.

Q: How does this solder paste 503 differ from SAC305?

A: TS‑503 has a lower silver content (0.3–0.5% vs 3.0%) and contains bismuth, which lowers the melting point. It is a Medium-Temperature Solder Paste designed for heat‑sensitive applications, while SAC305 is a higher‑temperature alloy.

Q: Is TS‑503 compatible with standard SMT equipment?

A: Yes. This solder paste 503 works with all standard automatic and semi‑automatic printers, as well as standard reflow ovens. Its Type‑4 powder supports fine‑pitch printing down to 0.25 mm.

Q: Does TS‑503 require post‑reflow cleaning?

A: No. TS‑503 is a no‑clean Medium-Temperature Solder Paste. The residue is clear, non‑conductive, and compatible with ICT testing, eliminating cleaning steps and reducing costs.

Q: What is the shelf life of this Medium-Temperature Solder Paste?

A: Six months from production date when stored at 5–10°C. At room temperature, it can be kept for up to 15 days.

Q: Can TS‑503 be used for nitrogen reflow?

A: Yes, it performs well in both air and nitrogen reflow environments.

Q: What industries commonly use this solder paste 503 product?

A: TS‑503 is widely used in LED lighting, consumer electronics, automotive, flexible PCB, and telecommunications manufacturing – anywhere that medium‑temperature reflow and reliable performance are required.

Conclusion

For manufacturers who demand lower processing temperatures without compromising solder joint quality, TENSAN TS‑503 is the definitive Medium-Temperature Solder Paste solution. This solder paste 503 product offers excellent printability, stable viscosity, no‑clean convenience, and proven electrical reliability – all at a cost‑effective low‑silver composition.

By choosing TS‑503, you select a Medium-Temperature Solder Paste that:

• Protects heat‑sensitive components with lower reflow temperatures (210–230°C peak)
• Delivers consistent, fine‑pitch print performance with Type‑4 powder
• Eliminates cleaning steps with no‑clean residue
• Ensures long‑term reliability with high SIR and electromigration resistance
• Meets full RoHS compliance as a lead‑free product
• Reduces material costs with low silver content (0.3–0.5%)

Upgrade to TENSAN TS‑503 – the Medium-Temperature Solder Paste that combines performance, protection, and cost efficiency.

Contact Information

TENSAN VIETNAM CO., LTD

TS10 Road, Tien Son Industrial Park, Bac Ninh Province, Vietnam

Tel: +84‑222‑650‑8818

Email: mark@sztensan.com