Some industrial fields have a "soft spot" for silicone potting adhesives, because the adhesive can form a fully elastic adhesive layer, which can effectively resist external influence factors. During use, various features can be brought into play to enhance the application value.
What are the application characteristics of silicone potting adhesive?
1. The operation is simple. It can be poured manually or with equipment, which is convenient and trouble-free.
2. One-component products are easier to operate and cure, which improves production efficiency and reduces cost input.
3. The moisture-proof and dust-proof performance is good, which greatly improves the safety of electronic components.
4. It has good elasticity after curing, ensuring the safety and stability of transporting electronic products.
5. Effectively resist ultraviolet rays and ozone, and withstand the corrosion of chemicals, so that electronic products can perform stably.
6. It does not contain any solvents, is safe and environmentally friendly, has passed the environmental protection standards of the European Union, and can be safely applied to electronic products. Choosing high-quality adhesives and cooperating with powerful suppliers will give you more peace of mind. Not only can you focus on the research of silicone potting adhesives, but you can also provide customized silicone potting adhesive application solutions. It has a wide range of uses and can be used in new energy and military industries. , medical, aviation, shipbuilding, electronics, automobiles, instruments, power supplies, high-speed rail and other industries.
In which fields are silicone potting adhesives suitable for use?
It is used in the bonding and packaging of electronic components to prevent various electronic accessories from being affected by moisture and moisture. It can bond and seal various modules and circuit boards, and the effect is very good. However, it is not suitable for bonding copper and polycarbonate materials, so as not to cause waste.
Apply the silicone potting compound in the appropriate field and firmly bond with a variety of materials. After thorough curing, a layer of elastic adhesive layer is formed, which tightly wraps various electronic components. It will not be affected by factors such as moisture, moisture, chemicals, and ultraviolet rays, prolonging the use time and reducing construction costs.
