Industry dynamic

What are the commonly used thermal conductive materials in electronic devices?

2024-07-11

Electronic devices have become an important tool in our daily work, study and life, most of the electronic devices will rise in temperature and generate heat after powering up and working. When the temperature is too high, it will not only have a certain impact on the electronic equipment, but also affect the user experience. In order to extend the service life of the product, to avoid overheating components and lead to equipment damage, need to use some thermal conductive materials to assist in heat dissipation.


Thermal Pad

Thermal Pad is based on silica gel, add a variety of auxiliary materials, through a special process of synthesis of a thermally conductive medium material. The thermal conductivity of this material is relatively good, with a certain degree of adhesion, in the electronic components in the gap filled with good fit, complete the heat-generating parts and heat dissipation parts of the heat transfer between the parts, but also play a role in insulation, cushioning, acoustic damping, sealing and so on.


Thermal Grease

Thermal grease, it is a thermally conductive silicone grease compound made of organic silicone as the main raw material, adding heat-resistant, thermally conductive materials with excellent performance. Thermal grease is a widely used thermal conductivity materials, can be used in the temperature range of the long-term state of the paste, usually not easy to oxidise and insoluble in water, stable performance and has excellent thermal conductivity, temperature resistance, electrical insulation, aging and waterproof properties.


Thermal Glue

Thermal glue is a kind of adhesive material containing thermally conductive filler, commonly used thermally conductive adhesive mainly include epoxy thermal adhesive, RTV thermal silicone, thermal silicone potting, thermal conductive silicone gel. Thermal glue can well fill the gap between the contact surface to transfer heat, improve the heat transfer between the two objects. If the thermal conductive adhesive is coated between the circuit board and heat sink, the air will be extruded out of the contact surface to complete the heat transfer between the heat generating part and the heat sink part, so that the contact surface can really achieve the thermal conductivity between the surfaces, thus effectively avoiding the decline in product performance and failures.


Thermal Clay

Thermal clay is a high-performance mud-like thermal conductivity material, its feel is similar to playdough, high thermal conductivity, low thermal resistance, with excellent heat transfer capacity and thixotropy. It has excellent thermal conductivity and thixotropy. It has good serviceability, permanent non-drying, no curing, and can be made into sheet or semi-flow state to meet the demand of automatic dispensing according to the need, and it is not hindered by the shape and size of the electronic components, and it can automatically fill the gaps and has excellent caulking effect.


Thermal Tape

Thermal tape is also called thermally conductive double-sided adhesive tape, which is made of acrylic polymer filled with thermally conductive ceramic powder and compounded with silicone adhesive. Thermal tape thermal conductivity is small, but has a soft, compression, suitability, strong adhesive, commonly used in small heat electronic parts and chip surface, in order to achieve thermal conductivity bonding, insulation and fixed role, can effectively reduce the size of the equipment, thereby reducing the production cost of electronic equipment.


The above thermal conductivity materials are some of the electronic equipment in the use of high thermal conductivity materials, they have their own advantages and disadvantages, according to their respective characteristics can be applied to different electronic equipment. Therefore, we can choose the thermal conductivity of the material according to the specific use of equipment and product suitability to consider, in order to find the most suitable thermal conductivity material.


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