Industry dynamic

Bulb potting


Bulb potting is a two-component silicone encapsulant dedicated to LED bulb products thermal conductivity potting, which is an industry branch in potting,  

belonging to LED bulbs Industry development of products. It consists of A, B two-part liquid. This two-component flexible silicone is designed for potting  

and protection of electronics in harsh conditions. When the two components are thoroughly mixed in a 1: 1 weight ratio or volume ratio, the mixed liquid  

will cure to a flexible elastomer suitable for potting and sealing of electrical / electronic products. The pot life and room temperature cure time are independent  

of the amount of material used. Curing material no significant shrinkage and temperature. Non-toxic rubber, non-corrosive; fully cured UV-resistant materials, 

 anti-aging properties, and can be repaired, with excellent weather resistance.

Mainly used for LED bulb, candle light LED lighting products, such as the end of the power line potting, the main play on the circuit board waterproof, earthquake 

 protection, improve the insulation properties of components, to the circuit board power yuan The heat generated during device operation is quickly transmitted  

to the aluminum body of the lamp body to prevent the components on the circuit board from being damaged in time due to heat dissipation.

A plastic as the main plastic material, known as the main agent, B plastic for the curing agent (also known as the catalyst). In the AB glue evenly mixed in the B plastic  

catalyst, the glue cross-linked reaction, the final formation of flexible colloid. 

Excellent weather resistance, long-term outdoor use.

Do not corrode metals and circuit boards.

Has excellent resistance to high temperature performance, electrical performance, insulation properties, good flexibility.

With detachable, sealed components can be removed for repair and replacement, and then use this potting glue can be repaired without leaving any trace.

Good fluidity, rapid self-leveling, and can use automatic plastic irrigation equipment, potting production efficiency.

Good anti-poisoning performance, suitable for general lead production circuit boards, flux and rubber seal potting.

Good thermal conductivity, small thermal resistance, good flame retardancy.

Tensan silicone 1: 1 potting compound is supplied in two packs, mixing A to B in a 1: 1 weight ratio. A material and B material fully mixed, gently agitated to  

reduce the amount of air mixed. The mixed material is left for 5 minutes prior to priming, which is good for removing the air entrapped during mixing. If you  

still have bubbles, you need vacuum degassing. Taking into account the expansibility of the material, the volume of the degassing vessel used should be  

at least 4 times the volume of the liquid. Vacuum bubbles from 28 to 30 inches of mercury can be used to remove air bubbles contained in the mixed material.  

Continue to vacuum until the liquid expanded and then returned to its original volume, the bubble will be completely eliminated. This process can take anywhere  

from 5 minutes to 10 minutes, depending on the amount of air entrained during mixing. In order to achieve the best curing effect, it is necessary to use glassware  

and glass or metal mixing equipment. Try to keep it steady while mixing to prevent mixing with excess air.

Certain chemicals, hardeners, plasticizers, fluxes, lead-producing boards, rubber seals inhibit cure. Pay special attention to the following materials:

Organic compounds containing N, P, S and the like, and ionic compounds containing Sn, Pb, Hg, Bi, As and the like.

Alkyne and vinyl-containing compounds.

Condensation-type compounds and used molds and tools, so as not to inactivate the platinum catalyst poisoning can not be normal curing.

1 at room temperature glue curing speed is too slow?

After the wide angle product is heated to 60 ℃, potting can be cured in about 30 minutes

2. Bulb potting local non-curing? 

Some parts of the circuit board that the potting glue touches have materials that affect the curing, such as lead solders, vulcanized rubber, condensation-type rubber,  

and some heat-shrinkable sleeves. It is recommended to take measures to clean the circuit board, clean the circuit board or the material for the appropriate treatment.

3 potting dielectric strength decreased?

Potting mixed in the mixing process a large number of bubbles, resulting in decreased dielectric strength after potting, it is recommended that the mixing, do not violently  

stirred, so as not to mix too much air, mixed, the use of vacuum equipment, the potting glue Bubbles out or stationary for 5 minutes to be discharged.

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