Thermal management is a critical issue in the design of electronic systems. As the complexity of the devices continues to grow, designers and manufacturers require improved technologies to effectively remove the generated heat. While fans, heat sinks and thermoelectric devices can be used to provide enough cooling power, the problem remains to get the heat from the hot components into the cooling hardware. Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better cooling. Shenzhen Tensan company thermal pads, thermal grease, thermal putty, thermal tape and graphite sheets can be used in a variety of electronic applications and industries including computers, laptops, tablet PCs, smart phones, routers, LEDs, solar, medical device, power supplies, wireless devices and the automotive industry.
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www.sztensan.com or www.chinatensan.com