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What are the classification of electronic potting glue?


What are the classification of electronic potting glue? There are many types of electronic potting adhesives, mainly: thermally conductive potting adhesives, epoxy resin potting adhesives, silicone potting adhesives, polyurethane potting adhesives, LED potting adhesives. Next, Shenzhen Tensan will mainly talk about the five major classification of potting sealant.


1. Thermally conductive potting compound (HCY) is a low-viscosity flame retardant two-component addition silicone thermally conductive potting compound, which can be cured at room temperature or cured by heating. The higher the temperature, the faster the curing. It is made by adding heat conductive material on the basis of ordinary potting silica gel or silica gel for bonding. It is a product made by generally good manufacturers: it will not produce any by-products in the curing reaction and can be applied to PC (Poly-carbonate) , PP, ABS, PVC and other materials and metal surfaces. It is suitable for heat conduction, insulation, waterproof and flame retardancy of electronic accessories, and its flame retardancy must reach UL94-V0 level. To meet the requirements of the EU ROHS directive. The main application areas are the potting of electronics, electrical components and electrical components, as well as the potting of similar temperature sensors.


2. Epoxy resin potting compound passed the EU ROHS specified standard, the cured product has high hardness, smooth surface, good gloss, fixed, insulating, waterproof, oil proof, dustproof, anti-theft, corrosion resistance, aging resistance, cold resistance Characteristics such as thermal shock. Used for packaging electronic transformers, AC capacitors, negative ion generators, aquarium water pumps, ignition coils, electronic modules, LED modules, etc. Suitable for potting of small and medium-sized electronic components, such as car, motorcycle igniter, LED drive power supply, sensor, toroidal transformer, capacitor, trigger, LED waterproof lamp, circuit board security, insulation, moisture (water) Potting.


3. There are many types of silicone encapsulant. Different types of silicone encapsulant have great performance in temperature resistance, waterproof performance, insulation performance, optical performance, adhesion to different materials, and soft hardness. difference. The silicone encapsulant can be added with some functional fillers to give it electrical and thermal conductivity and other properties. The mechanical strength of silicone encapsulant is generally poor, and it is precisely because of this property that it can be broken apart for easy maintenance, that is, if a component fails, you only need to pry open the encapsulant and replace it with a new one After the original, you can continue to use it. The color of the silicone encapsulant can generally be adjusted as desired. Or transparent or non-transparent or colored. The silicone encapsulant performs very well in terms of shock resistance, electrical performance, waterproof performance, high and low temperature resistance, and anti-aging performance.


4. Polyurethane encapsulant turns into PU encapsulant, usually composed of polyol and diisocyanate of oligomers such as polyvinegar, polyether and polydiene, with diol or diamine as chain extender. Polymerized. The potting compound can usually be prepared by the prepolymer method and the one-step process. Polyurethane potting material is characterized by low hardness, moderate strength, good elasticity, water resistance, mildew resistance, shock resistance, transparency, excellent electrical insulation and flame resistance, no corrosion to electrical components, steel, aluminum, copper, tin Other metals, as well as rubber, plastic, wood and other materials have good adhesion. The potting material can protect the installed and debugged electronic components and circuits from vibration, corrosion, humidity and dust.


5.LED encapsulant is an auxiliary material for LED encapsulation. It has high refractive index and high light transmittance. It can protect the LED chip and increase the luminous flux of the LED. The viscosity is small and it is easy to defoam. It is suitable for potting and molding. LED has better durability and reliability.


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