Industry dynamic

Red Glue

2020-11-25
Tensan red glue are a range of adhesives developed for temporary chip-bonding, prior to the wave-soldering process. They are all single component, heat-curing, epoxy adhesives which have excellent preservation qualities. “red glue” not only have rapid curing properties, with a 1~2 minute heating duration between 90~150℃, as required for SMD mounting, but their fine properties enable them to be applied by both high speed dispensing and screen printing alike. Tensan have a wide range and variety of grades to meet specific customer requirements.