Industry dynamic

Electronic adhesive classification

Electronic adhesives for microelectronic packaging can be divided into semiconductor IC packaging adhesives and PCB board-level assembly adhesives according to packaging forms. The semiconductor IC encapsulating Adhesives are EMC, LED Encapsulant, Die Attach wrapping Adhesives, Flip Chip Underfills, Dam and Fill Encapsulant. Adhesives for PCB board assembly are SMT Adhesives, COB Encapsulant, FPC Reinforcement Adhesives, CSP/BGA Underfills, Image Sensor Assembly Adhesives, conformal coating, Encapsulant, Encapsulant, Encapsulant, Thermal conductive adhesive (Thermally conductive adhesive).
Electronic adhesives can be divided into thermal curing, UV curing, anaerobic curing, moisture curing, UV curing + thermal curing, UV curing + moisture curing, etc. According to the material system, it can be divided into epoxy resin, acrylic ester, and others.

Electronic manufacturing on the commonly used adhesive epoxy resin, UV (UV) glue, hot melt glue, solder paste, anaerobic glue, double group glue, etc. Epoxy resin is generally cured by high temperature and has a strong adhesive force after curing. It is widely used in the bonding of functional devices and Underfill at the bottom. UV glue through UV curing, its pollution is small, fast curing, in some encapsulation dispensing, surface dispensing and other fields are most widely used. The solid crystal adhesive in the chip packaging has requirements on the bonding ability, thermal conductivity, and thermal resistance of the glue. Hot melt glue is the structure of PUR glue, it has the characteristics of low-temperature natural water vapor curing, curing fast, non-toxic and pollution-free, because of its unique advantages are gradually replacing other types of glue.

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